RS PRO Siloxane Volatile Firestop Putty Thermal Paste 3 W/mK, Blue, 55 ml 180-5302

RS PRO 180-5302 Siloxane Volatile Firestop Putty Thermal Paste with thermal conductivity of 3 W/mK is engineered to provide superior heat transfer and thermal management in sensitive electronic components and industrial equipment. This blue thermal putty exhibits long-term stability, does not cure, and resists pump out ensuring consistent performance. It is electrically insulating with a volume resistivity of 1013 Ohm-m, making it safe for use in electronics.

Designed to operate effectively in a wide temperature range from -50°C to 200°C, it suits applications such as battery packs, power supplies, automotive electronic control units, and more. The product features a dielectric breakdown strength of 10 kV/mm and a dielectric constant of 8, providing excellent electrical insulation properties. The specific gravity of 3.1 g/cm³ and a coefficient of thermal expansion at 175 ppm/K ensure mechanical stability during thermal cycling.

Key applications include high-performance CPUs, GPUs, LEDs, and industrial machinery where efficient heat dissipation is critical to maintaining component longevity and performance. The putty complies with RoHS standards, underlining its safety and environmental compliance. Its flammability rating is V-0, indicating resistance to ignition.

Excellent thermal conductivity of 3.2 W/m.K for effective heat transfer. Non-curing formulation ensures long-lasting performance without degradation. High electrical insulation properties with volume resistivity of 1013 Ohm-m.

Wide operating temperature range from -50°C to 200°C. Safe for electronic components with dielectric breakdown at 10 kV/mm. Stable mechanical properties with specific gravity 3.1 g/cm³ and thermal expansion 175 ppm/K. Suitable for use in battery packs, power supplies, automotive ECUs, and industrial electronics.

Complies with RoHS regulations and offers flammability rating of V-0.

This thermal paste is ideal for industrial, electronic manufacturing, HVAC, automotive, and laboratory environments requiring reliable thermal interface materials. Its high performance and safety profile make it an excellent choice for efficient heat management in critical electronic assemblies.

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