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RS PRO Aluminium Oxide Firestop Putty Thermal Paste 3.5 W/mK 100 g 180-5296
Specifications
| Country of Origin | India |
|---|---|
| Brand | RS PRO |
| Model | 180-5296 |
| Physical State | Paste |
| Thermal Conductivity | 3.5W/mK |
| Package Size | 100 g |
| Standards/Approvals | EN 374-2, EN 166, EN 149 |
| Chemical Component | Aluminium Oxide |
| RS PRO Thermal Paste, 3.4W/m·KBrand | RS PRO |
Key Features
- Contains aluminium oxide for excellent thermal conduction.
- Thermal conductivity rating of 3.5 watts per meter kelvin.
- Quick-drying and manually applied paste form.
- Maintains superior contact with electrical and semiconductor components.
- Wide operating temperature range and high-temperature stability.
- Suitable for processors, power semiconductors, and automotive electronics.
- Package size of 100 grams facilitates ease of application and storage.
- Complies with EN 374-2, EN 166, and EN 149 standards.
Product Description
RS PRO 180-5296 Aluminium Oxide Firestop Putty Thermal Paste offers advanced thermal management with a thermal conductivity of 3.5 W/mK and a white paste physical state designed for use in high-performance electronic applications.
This firestop putty is specifically formulated using aluminium oxide to efficiently dissipate heat between semiconductor devices and heat sinks, ensuring device reliability and optimal performance.
The compound is manually applied and quick-drying, allowing easy reworkability and maintaining superior contact with components even at phase change temperatures around 52 °C. It remains stable across a wide temperature range, making it suitable for demanding applications.
Common industrial and commercial uses include heat dissipation in high-performance computer processors, graphics cards, power semiconductors such as MOSFET, IGBT, RF audio/video components, and automotive electronics.
Complies with industry standards EN 374-2, EN 166, and EN 149, assuring quality and safety in thermal management. The compound features a dielectric breakdown voltage of greater than 10 kV/mm and a dielectric constant of 8 for electrical insulation.
The 100 g packaging supports maintenance and assembly operations in electronics manufacturing, HVAC, automotive, and power conversion environments. Contains aluminium oxide for excellent thermal conduction. Thermal conductivity rating of 3.5 watts per meter kelvin.
Quick-drying and manually applied paste form. Maintains superior contact with electrical and semiconductor components. Wide operating temperature range and high-temperature stability. Suitable for processors, power semiconductors, and automotive electronics.
Package size of 100 grams facilitates ease of application and storage. Complies with EN 374-2, EN 166, and EN 149 standards.
This RS PRO thermal paste is ideal for industrial electronics, laboratory instruments, HVAC systems, power conversion equipment, and automotive electronics where efficient heat dissipation and thermal coupling are critical.
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Frequently Asked Questions
The thermal conductivity of this thermal paste is 3.5 W/mK, which allows for efficient heat dissipation between components.
The thermal paste is packaged in a size of 100 grams, facilitating ease of application and storage.
This thermal paste contains aluminium oxide, which is known for its excellent thermal conduction properties.
It complies with EN 374-2, EN 166, and EN 149 standards, ensuring quality and safety in thermal management applications.
The thermal paste is in a paste form, which allows for manual application and quick drying.
It is suitable for use in high-performance computer processors, power semiconductors, graphics cards, and automotive electronics.
The dielectric breakdown voltage of this thermal paste is greater than 10 kV/mm, providing effective electrical insulation.
The paste maintains stability across a wide operating temperature range, making it suitable for demanding applications.
It maintains superior contact with components even at phase change temperatures around 52 °C, ensuring optimal performance.
This thermal paste is manufactured in India.
Yes, this thermal paste is suitable for automotive electronics, ensuring efficient heat dissipation in these applications.
The formulation of the thermal paste allows it to dry quickly after application, facilitating easy reworkability.
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