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| Country of Origin | United States |
|---|---|
| Brand | Bergquist |
| THICKNESS | 0.152mm |
| Length | 19.05mm |
| Model | SPK4-0.006-AC-54 |
| Width | 12.7mm |
| Series | Sil-Pad K4 |
| Maximum Operating Temperature | 180°C |
| Hardness | Shore A 90 |
| Thermal Conductivity | 0.9W/mK |
| Minimum Operating Temperature | -60°C |
| Standards/Approvals | RoHS |
| Trade Name | Sil-Pad K4 |
| Conductive Material | Thin Film Polyimide |
Bergquist SPK4-0.006-AC-54 is a self-adhesive thermal interface pad from the Sil-Pad K4 Series, featuring a thin film polyimide material and a thickness of 0.152 mm. This thermal pad combines efficient heat transfer with electrical insulation, making it suitable for a variety of industrial and electronic applications.
The pad exhibits a thermal conductivity of 0.9 W/mK, facilitating effective dissipation of heat in electronics, HVAC equipment, and thermal management systems. Its Shore A 90 hardness ensures mechanical robustness, while the self-adhesive surface allows easy application without the need for additional thermal grease.
With operational temperature limits ranging from -60°C to 180°C, the SPK4-0.006-AC-54 pad can function reliably in a broad range of environments, including laboratory equipment, manufacturing electronics, and industrial machinery.
The compact size of 19.05 mm length by 12.7 mm width suits precise applications requiring thin, durable thermal insulation layers. This product is RoHS compliant, guaranteeing environmental safety and quality standards adherence.
Typical use cases include thermal management in electronics heating and cooling components, ensuring efficient heat conduction while providing electrical isolation. Thermal conductivity of 0.9 W/mK ensures effective thermal management.
Pad thickness of 0.152 mm provides thin film compatibility. Self-adhesive backing supports easy installation without thermal paste. Made from durable thin film polyimide material with high dielectric strength. Operates safely from -60°C to 180°C for versatile industrial environments.
RoHS compliant for environmental and quality assurance. Compact dimensions of 19.05 mm by 12.7 mm cater to precise application needs. Provides reliable electrical insulation and heat dissipation in industrial and electronics uses.
This Bergquist thermal interface pad is suitable for applications in electronics manufacturing, HVAC systems, laboratory instrumentation, and other industrial thermal management environments. Explore more electronics components and Thermal Pads in the EnvMart catalogue for varied industrial and commercial needs.
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