Bergquist Series Thermal Interface Pad, 0.015 in Thickness, 3.5 W/mK Thermal Conductivity, 19.05 mm x 12.7 mm SP2000

Bergquist SP2000 Thermal Interface Pad SP2000 is a premium-grade thermal interface material engineered to meet the stringent requirements of aerospace, military, and other high-reliability commercial applications. This pad provides exceptional thermal conductivity of 3.5 W/mK with a thickness of 0.015 inches, delivering superior heat dissipation between electronic components and heat sinks or chassis.

The pad features a fibreglass conductive material base coupled with a boron nitride reinforced silicon elastomer matrix, achieving excellent thermal and dielectric properties. Its Shore A 90 hardness balances mechanical firmness with conformability to uneven surfaces, enhancing contact efficiency without grease or adhesives.

With dimensions of 19.05 mm length and 12.7 mm width, this compact pad is suitable for tight spaces on printed circuit boards and electronic assemblies. It operates reliably over a wide temperature range from -60°C up to a maximum of 200°C, enabling deployment in harsh industrial and aerospace environments.

The material complies with RoHS standards, ensuring it is free from hazardous substances, contributing to environmentally responsible manufacturing. Its grease-free and self-contained design reduces risk of contamination and simplifies assembly processes.

Bergquist SP2000 pads are widely used in electronics heating and cooling systems, thermal management in HVAC, and other industrial electronics where robust thermal interface materials are critical for performance and reliability. The grease-free insulator maximises both dielectric strength and thermal transfer efficiency, making it ideal for electronic packaging and industrial thermal management applications.

Thickness of 0.015 inches provides optimal thermal transfer. Thermal conductivity rated at 3.5 W/mK for effective heat dissipation. Constructed from fibreglass material ensuring electrical insulation and mechanical durability.

Dimensions of 19.05 mm length by 12.7 mm width suit compact electronic components. Operates reliably from -60°C to 200°C, suitable for extreme environments. Shore A 90 hardness offers firm yet conformable surface contact.

RoHS compliant, aligning with environmental safety standards. Boron nitride reinforced silicon elastomer composition enhances thermal and electrical performance. Grease-free design reduces maintenance and contamination risk.

Ideal for high-reliability electronic packaging in industrial, aerospace, and military sectors.

This product belongs to the Thermal Pads category under Electronics Components and is a reliable solution for industrial, laboratory, aerospace, and commercial electronics thermal management needs. Explore more Bergquist thermal interface materials and industrial-grade electronics components at EnvMart for your thermal management solutions.