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AAVID THERMALLOY Heatsink for D3 PAK (TO-268), power SO-10 (MO-184), SO-10, D2 PAK (TO-263), D-PAK (TO-252) 573300D00010G
Specifications
| Country of Origin | India |
|---|---|
| Brand | AAVID THERMALLOY |
| Material | Copper |
| Colour | Silver |
| Height | 10.16mm |
| Length | 12.7mm |
| Model | 573300D00010G |
| Finish | Tin Plated |
| Width | 26.16mm |
| Thermal Resistance | 18°C/W |
| Standards/Approvals | RoHS |
| Fastening | PCB Mount |
Key Features
- Constructed from high-quality copper material for superior heat dissipation.
- Tin plated finish ensures corrosion resistance and long-term reliability.
- Thermal resistance of 18°C/W provides efficient thermal management.
- Suitable for surface mount heat sink applications in power supplies and semiconductor packages.
- PCB mount fastening offers stable attachment and effective heat transfer.
- Complies with RoHS standards ensuring environmental and safety compliance.
Product Description
AAVID THERMALLOY 573300D00010G Heatsink is engineered for effective thermal management of D3 PAK (TO-268), power SO-10 (MO-184), SO-10, D2 PAK (TO-263), and D-PAK (TO-252) semiconductor packages. With a copper construction and tin-plated finish, this heatsink offers superior conductivity and corrosion resistance to ensure stable performance under demanding conditions.
Measuring 12.7 mm in length, 26.16 mm in width, and 10.16 mm in height, it is optimized for PCB mounting, allowing direct soldering to modified drain pads. This design creates a thermal transfer path from the package tab to the heatsink, thus reducing device junction temperatures efficiently.
The heatsink's thermal resistance rating of 18°C/W facilitates effective heat dissipation, making it suitable for power supplies, power semiconductors, and surface mount heat sink applications in industrial, electronics, and HVAC cooling contexts.
The tin plating finish enhances durability and environmental resistance. Compliance with RoHS directives ensures this heatsink meets environmental safety standards. High conductivity copper material delivers reliable thermal management.
Tin plated surface provides corrosion protection and reliability. Compact dimensions fit a range of power semiconductor packages. PCB surface mount facilitates easy integration into electronic assemblies. Thermal resistance of 18°C/W optimizes heat transfer efficiency.
Meets RoHS environmental and safety regulations. Ideal for industrial and electronics cooling applications.
This heatsink is a key component for improving the thermal management of electronic power devices, extending their operational lifespan and stability. Browse our collection of AAVID THERMALLOY heatsinks and other thermal management solutions at EnvMart for comprehensive industrial and electronics cooling options.
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Frequently Asked Questions
The thermal resistance of this heatsink is 18°C/W, which facilitates effective heat dissipation for power semiconductor packages.
It is constructed from high-quality copper, which provides superior thermal conductivity, and features a tin-plated finish for corrosion resistance.
The heatsink measures 12.7 mm in length, 26.16 mm in width, and 10.16 mm in height, making it compact for various applications.
This model is designed for PCB mounting, allowing for direct soldering to modified drain pads for stable attachment.
It is engineered for use with D3 PAK (TO-268), power SO-10 (MO-184), SO-10, D2 PAK (TO-263), and D-PAK (TO-252) packages.
The heatsink features a tin-plated finish, which enhances its durability and provides corrosion protection.
Yes, it complies with RoHS standards, ensuring it meets environmental and safety regulations.
It is suitable for surface mount heat sink applications in power supplies and semiconductor packages, particularly in industrial and electronics cooling contexts.
The heatsink has a silver color due to its tin-plated finish.
The country of origin for this heatsink is India.
Its design creates a thermal transfer path from the package tab to the heatsink, effectively reducing device junction temperatures and enhancing thermal management.
It uses PCB mount fastening, which provides stable attachment and effective heat transfer in electronic assemblies.
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