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AAVID THERMALLOY Heatsink Copper Surface Mount Thermal Management 14°C/W 573400D00010G
Specifications
| Country of Origin | India |
|---|---|
| Brand | AAVID THERMALLOY |
| Material | Copper |
| Colour | Silver |
| Height | 10.16mm |
| Length | 12.7mm |
| Model | 573400D00010G |
| Finish | Tin Plated |
| Width | 30.99mm |
| Thermal Resistance | 14°C/W |
| Standards/Approvals | RoHS |
| Fastening | SMT |
| Compatible Package Type | TO-268, SO-10, TO-263, TO-252 |
| Pay online using | Or choose to pay later via bank transfer |
| RS Stock No. | 712-4333Brand: AAVID THERMALLOYManufacturers Part No.: 573400D00010G |
Key Features
- Constructed from copper material to ensure efficient thermal conductivity.
- Tin-plated silver finish provides corrosion resistance and durability.
- Compatible with multiple package types including TO-268, TO-263, and TO-252.
- Surface mount technology fastening simplifies assembly on PCBs.
- Thermal resistance rating of 14°C/W suitable for moderate heat dissipation.
- Compliant with RoHS directives ensuring environmental safety.
- Ideal for electronics heating and cooling applications in industrial and electrical systems.
Product Description
The AAVID THERMALLOY 573400D00010G heatsink is a premium copper surface mount heat sink developed for power semiconductor packages such as SO-10 (MO-184), D-PAK (TO-252), D2 PAK (TO-263), and D3 PAK (TO-268). Featuring a tin-plated silver finish, it delivers reliable corrosion resistance and durable performance in electronic thermal management.
This heatsink is designed to be soldered directly onto a modified drain pad offering an effective thermal transfer path from the package tab to the heat sink, achieving a thermal resistance of 14°C/W. Its dimensions, 12.7mm length, 30.99mm width, and 10.16mm height, make it compact yet efficient for cooling semiconductor devices.
The surface mount technology (SMT) fastening facilitates easy automated PCB assembly, reducing labor and improving repeatability. This heatsink complies with RoHS standards demonstrating adherence to environmental and safety regulations.
Applications encompass various industrial, electrical automation, HVAC, and electronics cooling scenarios where effective heat dissipation from power semiconductors is critical to maintain system reliability and performance.
Constructed from high-quality copper for excellent thermal conductivity. Tin-plated silver finish extends service life by preventing oxidation. Compatible with multiple semiconductor package types including TO-252, TO-263, and TO-268.
Surface mount fastening method supports automated production processes. Compact form factor with precise dimensions for space-constrained designs. Thermal resistance of 14°C/W effectively dissipates heat from electronic components.
RoHS compliant, suitable for environmentally conscious manufacturing. Widely used in electrical, industrial automation, and HVAC systems for power semiconductor cooling. Explore similar thermal management solutions in our Heatsinks category at EnvMart for reliable and efficient electronic cooling components.
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Frequently Asked Questions
The thermal resistance rating of this heatsink is 14°C/W, which is suitable for moderate heat dissipation.
This heatsink is constructed from copper, which ensures efficient thermal conductivity, and features a tin-plated silver finish for corrosion resistance.
It is compatible with multiple package types including TO-268, TO-263, TO-252, and SO-10 (MO-184).
The dimensions of this heatsink are 12.7mm in length, 30.99mm in width, and 10.16mm in height.
The SMT fastening method allows for easy automated assembly on PCBs, simplifying the installation process.
Yes, this heatsink is RoHS compliant, ensuring adherence to environmental safety regulations.
It is suitable for various applications in industrial, electrical automation, HVAC, and electronics cooling scenarios where effective heat dissipation from power semiconductors is critical.
The heatsink features a tin-plated silver finish, which provides corrosion resistance and extends its service life by preventing oxidation.
The country of origin for this heatsink is India.
Its compact form factor with precise dimensions makes it efficient for cooling semiconductor devices, especially in space-constrained designs.
The primary function of this heatsink is to provide effective thermal management for power semiconductor packages, ensuring reliable system performance.
This heatsink uses surface mount technology (SMT) fastening for installation, which simplifies the assembly process on printed circuit boards.
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