Bourns Non-Resettable Ceramic Body Fuse 3A 32V DC Time Delay SF-0603S300-2

Bourns SF-0603S300-2 is a non-resettable single blow fuse with a ceramic body designed for use at 3 amperes and 32 volts DC with a slow blow (time delay) fuse characteristic. It features a miniature 0603 (1608 EIA) surface mount technology footprint, with a compact 0.45 mm height and 1.6 mm depth, suitable for space-saving applications.

This fuse offers excellent overcurrent protection for sensitive electronic circuits including alarm systems, audio/visual equipment, computer boards, portable telephones, power supplies, and medical devices. The ceramic body provides enhanced durability and thermal resistance, supporting a maximum operating temperature of 105°C and a minimum of -40°C.

With a breaking capacity of 50 amps and a low internal resistance of 0.02 ohms, it effectively protects against short circuits and overloads while maintaining low power loss. The terminals are made of tin-plated nickel copper, ensuring reliable and corrosion-resistant connections. This component is packaged on a reel, facilitating automated insertion and improved production efficiency for manufacturers.

This fuse features a slow blow time delay characteristic for controlled circuit protection. The fuse has a small 0603 surface mount footprint measuring 0.45 mm in height and 1.6 mm in depth. Its body material is ceramic to ensure durability and heat resistance.

The fuse is rated for a breaking capacity of 50 A with operating temperatures ranging from -40°C to 105°C. It is packaged on a reel suitable for automated assembly processes. Terminal material consists of tin-plated nickel copper for reliable connections.

The fuse has a low resistance of approximately 0.02 ohms, minimizing power loss. Designed for use in protecting sensitive electronic equipment such as alarms, audio/video devices, and power supplies.

This fuse is particularly suited for use in industrial, electronics manufacturing, telecommunications, and medical equipment assembly. Its compact size and reliable characteristics enable integration into high-density circuit boards where space and protection are critical factors.

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