Seeit Surface Mount 1.27 mm Pitch Test & Burn-in Socket, DIP to TSOP ADA-TSOP32-14

The Seeit ADA-TSOP32-14 is a high-quality surface mount test and burn-in socket designed to convert TSOP32 packages to DIP32 format, featuring a 1.27 mm pitch suitable for precise electronic applications.

This socket enables reliable testing and burn-in processes by providing a stable connection interface. It supports 32 contacts per side with phosphor bronze contact material plated in tin, delivering excellent electrical conductivity and mechanical durability.

The housing is crafted from robust polybutylene terephthalate, ensuring thermal and mechanical stability during testing cycles. Rated for a current of 1 ampere, it accommodates typical currents of test environments without degradation.

This adapter is surface mount designed, allowing seamless integration onto printed circuit boards for laboratory, manufacturing, and industrial testing purposes. It is manufactured in France, assuring compliance with stringent quality standards.

Supports DIP and TSOP connection types with 32 contacts each. Uses phosphor bronze contacts with tin plating for durability. Constructed of polybutylene terephthalate housing material. Designed for 1A continuous current use.

Surface mount for PCB compatibility. Enables precise test and burn-in cycles for TSOP chips. Manufactured under high-quality conditions in France. Ideal for electronics manufacturing and testing laboratories.

This socket is part of the Seeit range of test and burn-in sockets designed for various IC package conversions, facilitating flexible and efficient testing solutions in electronic component manufacturing environments.

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