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Seeit Surface Mount 1.27 mm Pitch Test & Burn-in Socket DIP to TSOP ADA-TSOP32-20

Category Electronics Components Brand Seeit Condition New

Specifications

Country of Origin France
Brand Seeit
Current 1A
Model ADA-TSOP32-20
Mount Type Surface
Housing Material Polybutylene Terephthalate
Contact Material Phosphor Bronze
Series PLCC
Pitch 1.27mm
Contact Plating Tin
Number of Contacts A 32
Connection A DIP
Connection B TSOP
ADA-SOIC16-150 SOP8/14/16 to DIP16 (454-6803)
ADA-QFN28 MLF28/QFN28 to DIP28 (919-5536)
ADA-SO28-300 SOP18/28 to DIP28 (509-6292)
ADA-PLCC32-32 PLCC32 to DIP28 / DIP32 (454-6819)
ADA-PLCC32 PLCC32 to DIP32 (919-5539)
ADA-TQFP32 TQFP32 to DIP32 (919-5532)
ADA-TSOP32-14 TSOP32 to DIP32 (509-6309)
ADA-TSOP32-20 TSOP32 to DIP32 (454-6831)
ADA-QFN44 MLF44/QFN44 to DIP44 (919-5545)
ADA-PLCC44 PLCC44 to DIP44 (454-6825)
ADA-TSOP48-20 TSOP32/40/48 to DIP48 (454-6847)

Key Features

  • Designed for surface mount applications enabling versatile PCB integration.
  • Features a 1.27 mm pitch for precise alignment and connectivity.
  • Supports DIP connection with 32 contacts and TSOP with 32 contacts.
  • Contact plating made of tin ensures consistent electrical performance.
  • Constructed with phosphor bronze contacts and polybutylene terephthalate housing for durability.
  • Rated for 1 Amp current, suitable for typical electronic testing needs.
  • Manufactured in France maintaining quality standards.
  • Ideal for use in electronics manufacturing, testing, and burn-in phases.

Product Description

Seeit ADA-TSOP32-20 is a high-precision surface mount Test & Burn-in Socket designed for converting DIP packages to TSOP with a pitch of 1.27 mm. This adapter facilitates reliable electrical connection during IC testing and burn-in procedures, essential in electronics manufacturing and quality assurance.

The socket accommodates 32 contacts on both DIP and TSOP sides, ensuring exact alignment and signal integrity. Contacts are plated with tin and made of phosphor bronze for excellent conductivity and mechanical resilience, while the housing utilizes polybutylene terephthalate for thermal stability and robustness.

Rated for a current capacity of 1 Amp, this test socket is well suited for various testing environments including laboratory, industrial electronics production, and quality control processes. Its surface mount design enables easy PCB integration and supports efficient workflow in electronics assembly and testing lines.

Manufactured in France, the ADA-TSOP32-20 socket adheres to reliable construction and quality assurance standards, although specific certifications are not declared. This product is part of a broader range of universal adaptors by Seeit intended to support DIP package conversion across multiple IC formats.

Designed for surface mount applications enabling versatile PCB integration. Features a 1.27 mm pitch for precise alignment and connectivity. Supports DIP connection with 32 contacts and TSOP with 32 contacts. Contact plating made of tin ensures consistent electrical performance.

Constructed with phosphor bronze contacts and polybutylene terephthalate housing for durability. Rated for 1 Amp current, suitable for typical electronic testing needs. Manufactured in France maintaining quality standards.

Ideal for use in electronics manufacturing, testing, and burn-in phases.

This seeit test & burn-in socket is an essential component for electronic engineers and manufacturers seeking reliable connections during IC testing and quality validation. Explore EnvMart categories to find additional IC Socket Adapters and related electronic testing components for comprehensive solutions.

Explore more products in our Electronics Components category.

Seeit Surface Mount 1.27 mm Pitch Test & Burn-in Socket DIP to TSOP ADA-TSOP32-20
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