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Silicon Labs Bluetooth Chip Class 3, 2.0 & 4.1, 1Mbps Data Rate, 3dBm Output, UART & SPI Interface BGM113A256V2

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Silicon Labs Bluetooth Chip Class 3, 2.0 & 4.1, 1Mbps Data Rate, 3dBm Output, UART & SPI Interface BGM113A256V2

Name: Silicon Labs Bluetooth Chip Class 3, 2.0 & 4.1, 1Mbps Data Rate, 3dBm Output, UART & SPI Interface BGM113A256V2
Brand: Silicon Labs
SKU: 184554
Price: 20.22 USD
Availability: InStock

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Category Bluetooth Modules Brand Silicon Labs Condition New

Specifications

Country of Origin	China
Frequency	2.4GHz
Brand	Silicon Labs
Height	1.9mm
Length	15.73mm
Model	BGM113A256V2
Width	9.15mm
Series	BGM113
Maximum Operating Temperature	85°C
Minimum Operating Temperature	-40°C
Receiver Sensitivity	-93dBm
Interface Type	UART, SPI
Bluetooth Version	2.0, 4.1
Maximum Supply Voltage	3.8V
Minimum Supply Voltage	1.85V
Bluetooth Class	Class 3
32-bit ARM® Cortex®-M4 core at 38.4 MHz / Flash memory	256 kB / RAM: 32 kB

Key Features

The chip operates at a frequency of 2.4GHz, ideal for Bluetooth applications.
Interfaces include UART and SPI for versatile connectivity options.
Compact dimensions of 15.73mm length, 9.15mm width, and 1.9mm height.
Operates within a voltage range of 1.85V minimum to 3.8V maximum for flexible power supply.
Designed for operation in temperatures from -40°C to 85°C.
Integrated ARM Cortex-M4 core running at 38.4 MHz with onboard 256 kB flash and 32 kB RAM.
Incorporates a hardware crypto-accelerator and true random number generator for enhanced security.
Includes an integrated antenna suitable for a 50-meter range in Bluetooth Smart applications.

Product Description

Silicon Labs BGM113A256V2 Bluetooth Chip is a Class 3 Bluetooth Smart module supporting Bluetooth versions 2.0 and 4.1, delivering data rates of 1Mbps with a maximum output power of 3dBm and receiver sensitivity down to -93dBm. It operates on the 2.4GHz frequency band with UART and SPI interfaces, suitable for a wide range of wireless communication installations.

This compact module measures 15.73mm in length, 9.15mm in width, and 1.9mm in height, making it ideal for integration into small form-factor devices. Operating voltage ranges from 1.85V to 3.8V, allowing it to be used in battery-powered and low-power applications with operating temperature suitability from -40°C up to 85°C, ensuring reliability in harsh environments.

The BGM113 features an integrated 32-bit ARM Cortex-M4 processor running at 38.4 MHz with 256 kB flash memory and 32 kB RAM. It includes autonomous hardware crypto-acceleration and a true random number generator, providing robust security for data transmission. The onboard antenna enables up to a 50-meter wireless range, optimal for Bluetooth Smart devices.

Designed primarily for Bluetooth Smart applications, this module finds extensive use in IoT sensors, health and fitness wearable devices, smartphones, tablets, and commercial and retail wireless environments. Its low power consumption and integrated features make it suitable for battery-operated devices requiring high performance and energy efficiency.

Supports Bluetooth 4.1 and is software upgradable to Bluetooth 4.2. Complies with no specific standards/approvals. Part of the BGM113 series renowned for reliability in wireless connectivity. Manufactured in China ensuring controlled production quality.

Explore more Bluetooth Modules from Silicon Labs and related electronic components at EnvMart for your industrial and commercial wireless communication needs.