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| Country of Origin | China |
|---|---|
| Brand | Arcol Ohmite |
| Height | 11.68mm |
| Length | 12.7mm |
| Model | DV-T263-301E-TR |
| Finish | Black Anodised |
| Width | 35.31mm |
| For Use With | TO-252, TO-263 and TO-268 |
| Standards/Approvals | RoHS |
| Compatible Package Type | TO-263, TO-268, TO-252 |
Arcol Ohmite DV-T263-301E-TR heatsink is engineered for efficient thermal management of semiconductors utilizing TO-252, TO-263, and TO-268 packages. The heatsink body is extruded aluminium with a black anodised finish, providing robustness and corrosion resistance suitable for industrial and electronic equipment applications.
The unique patent-pending design incorporates tin plated solderable rods, mechanically forged to the heatsink body to significantly reduce thermal resistance between the semiconductor component and heatsink. This radius-mounted roller design maximizes heat transfer and mitigates the thermal bottleneck commonly experienced in stamped and staked heatsinks, resulting in thermal performance improvements up to 300% compared to conventional aluminium stamped heatsinks.
The heatsink dimensions of 11.68 mm height, 12.7 mm length, and 35.31 mm width allow for compact, space-efficient installation in dense PCB layouts. The lightweight aluminium construction facilitates faster pick and place assembly, effectively reducing manufacturing cycle times, which is ideal for high-volume SMT production environments.
Available in tape and reel packaging, this heatsink supports automated manufacturing processes. The product is compliant with RoHS directives, ensuring environmental and safety standards are met. It is widely used in electronics manufacturing, HVAC systems, industrial controls, and other applications requiring efficient heat dissipation for semiconductor devices.
The heatsink features black anodised finish for superior corrosion resistance. Dimensions: 11.68 mm height, 12.7 mm length, 35.31 mm width for compact integration. Aluminium extruded body with patent-pending tin plated solderable roller design.
Thermal performance improved up to 300% over comparable stamped aluminium heatsinks. Compatible with TO-252, TO-263, and TO-268 semiconductor packages for broad usability. Lightweight design expedites pick and place SMT assembly workflows.
Comes in tape and reel for streamlined production line usage. RoHS compliant ensuring adherence to environmental safety regulations.
Optimize your thermal management solutions with this advanced Arcol Ohmite heatsink. Browse more Heatsinks and thermal management products at EnvMart for diverse industrial and electronics applications.
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