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Arcol Ohmite Heatsink for TO-252, TO-263 and TO-268 Packages 11.68 mm Height 12.7 mm Length 35.31 mm Width DV-T263-301E-TR

Category Heatsinks Brand Arcol Ohmite Condition New

Specifications

Country of Origin China
Brand Arcol Ohmite
Height 11.68mm
Length 12.7mm
Model DV-T263-301E-TR
Finish Black Anodised
Width 35.31mm
For Use With TO-252, TO-263 and TO-268
Standards/Approvals RoHS
Compatible Package Type TO-263, TO-268, TO-252

Key Features

  • The heatsink features black anodised finish for superior corrosion resistance.
  • Constructed with aluminium extruded body combined with tin plated solderable rods for optimal heat transfer.
  • Innovative roller design improves thermal performance up to 300% compared to stamped aluminium heatsinks.
  • Compatible with surface mount technology (SMT) to expedite manufacturing cycles.
  • Available in tape and reel format to support automated assembly processes.
  • Fully RoHS compliant, adhering to environmental standards for electronics components.

Product Description

Arcol Ohmite DV-T263-301E-TR heatsink is engineered for efficient thermal management of semiconductors utilizing TO-252, TO-263, and TO-268 packages. The heatsink body is extruded aluminium with a black anodised finish, providing robustness and corrosion resistance suitable for industrial and electronic equipment applications.

The unique patent-pending design incorporates tin plated solderable rods, mechanically forged to the heatsink body to significantly reduce thermal resistance between the semiconductor component and heatsink. This radius-mounted roller design maximizes heat transfer and mitigates the thermal bottleneck commonly experienced in stamped and staked heatsinks, resulting in thermal performance improvements up to 300% compared to conventional aluminium stamped heatsinks.

The heatsink dimensions of 11.68 mm height, 12.7 mm length, and 35.31 mm width allow for compact, space-efficient installation in dense PCB layouts. The lightweight aluminium construction facilitates faster pick and place assembly, effectively reducing manufacturing cycle times, which is ideal for high-volume SMT production environments.

Available in tape and reel packaging, this heatsink supports automated manufacturing processes. The product is compliant with RoHS directives, ensuring environmental and safety standards are met. It is widely used in electronics manufacturing, HVAC systems, industrial controls, and other applications requiring efficient heat dissipation for semiconductor devices.

The heatsink features black anodised finish for superior corrosion resistance. Dimensions: 11.68 mm height, 12.7 mm length, 35.31 mm width for compact integration. Aluminium extruded body with patent-pending tin plated solderable roller design.

Thermal performance improved up to 300% over comparable stamped aluminium heatsinks. Compatible with TO-252, TO-263, and TO-268 semiconductor packages for broad usability. Lightweight design expedites pick and place SMT assembly workflows.

Comes in tape and reel for streamlined production line usage. RoHS compliant ensuring adherence to environmental safety regulations.

Optimize your thermal management solutions with this advanced Arcol Ohmite heatsink. Browse more Heatsinks and thermal management products at EnvMart for diverse industrial and electronics applications.

Arcol Ohmite Heatsink for TO-252, TO-263 and TO-268 Packages 11.68 mm Height 12.7 mm Length 35.31 mm Width DV-T263-301E-TR
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Frequently Asked Questions

This heatsink has dimensions of 11.68 mm in height, 12.7 mm in length, and 35.31 mm in width.

It is compatible with TO-252, TO-263, and TO-268 packages, making it versatile for various applications.

The heatsink features a black anodised finish, which provides superior corrosion resistance.

This model offers thermal performance improvements of up to 300% compared to conventional stamped aluminium heatsinks due to its unique roller design.

It is constructed from extruded aluminium, which contributes to its lightweight and effective heat dissipation properties.

Yes, it is fully RoHS compliant, adhering to environmental standards for electronics components.

The heatsink is available in tape and reel format, which supports automated assembly processes.

The heatsink is manufactured in China.

The innovative roller design improves thermal performance significantly by reducing thermal resistance between the semiconductor and the heatsink.

The lightweight aluminium construction facilitates faster pick and place assembly, effectively reducing manufacturing cycle times.

It is widely used in electronics manufacturing, HVAC systems, and industrial controls, where efficient heat dissipation is required for semiconductor devices.

The model number for this heatsink is DV-T263-301E-TR.

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