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STMicroelectronics Audio Power Amplifier IC SOIC-8 0.38W Class A-B TDA2822D

Category Audio Amplifier ICs Brand STMicroelectronics Condition New

Specifications

Country of Origin India
Brand STMicroelectronics
Height 1.25mm
Length 5mm
Model TDA2822D
Width 4mm
Output Power 0.38W
Mount Type Surface
Series TDA2822D
Maximum Operating Temperature 150°C
Package Type SOIC
Minimum Operating Temperature -40°C
Number Of Channels 1
Pin Count 8
Maximum Supply Voltage 12V
Minimum Supply Voltage 3V
Amplifier Type Audio Power Amplifier
Amplifier Class Class A-B

Key Features

  • Compact SOIC-8 package suitable for surface mount applications.
  • Delivers 0.38W output power, ideal for low-power audio amplification.
  • Class A-B design offers optimal performance for headphones and speakers.
  • Supports supply voltage from 3V to 12V, expanding compatibility for various electronics.
  • Operates reliably over a wide temperature range from -40°C to 150°C.
  • Integrated capless and filterless amplification for design efficiency.
  • Single channel audio amplifier targeting low-power systems.

Product Description

The STMicroelectronics TDA2822D is a highly integrated audio power amplifier IC designed for low-power audio applications. Housed in a compact SOIC-8 surface mount package, it features a single channel Class A-B amplifier suited for headphone and small speaker systems. With a nominal output power of 0.38W, the device is optimized for portable and embedded electronics where space and efficiency are critical.

This amplifier operates within a wide supply voltage range of 3V to 12V and is capable of functioning reliably over an extended temperature range from -40°C to 150°C. It implements capless and filterless amplification, simplifying product designs, reducing component count, and improving total cost efficiency.

The TDA2822D delivers excellent audio performance thanks to its Class A-B architecture, ideal for applications such as headphone amplifiers, compact audio devices, or embedded speaker systems in industrial or consumer electronics.

Mount type is surface with a small footprint: height of 1.25mm, length of 5mm, and width of 4mm, facilitating easy integration in PCBs with space constraints. Its 8-pin SOIC form factor supports straightforward assembly in production environments.

Superior reliability and thermal stability are ensured by the device's wide temperature tolerance and integrated features. It is suitable for use in industrial, laboratory, commercial, and embedded systems requiring robust audio amplification for low-power devices.

Compact SOIC-8 package suitable for surface mount applications. Delivers 0.38W output power, ideal for low-power audio amplification. Class A-B design offers optimal performance for headphones and speakers. Supports supply voltage from 3V to 12V, expanding compatibility for various electronics.

Operates reliably over a wide temperature range from -40°C to 150°C. Integrated capless and filterless amplification for design efficiency. Single channel audio amplifier targeting low-power systems. Height of 1.25mm, length 5mm, width 4mm for compact PCB layout.

Explore more audio amplifier ICs and STMicroelectronics products in the Audio Amplifier ICs category on EnvMart.

STMicroelectronics Audio Power Amplifier IC SOIC-8 0.38W Class A-B TDA2822D
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Frequently Asked Questions

It operates reliably over a wide temperature range from -40°C to 150°C.

This unit supports a supply voltage range from 3V to 12V, allowing for compatibility with various electronic systems.

The amplifier is housed in a compact SOIC-8 surface mount package, facilitating easy integration into PCBs.

The dimensions of this unit are height 1.25mm, length 5mm, and width 4mm, which supports compact PCB layouts.

This model is designed for surface mounting, which is ideal for space-constrained applications.

The TDA2822D is manufactured in India.

The amplifier features integrated capless and filterless amplification, which simplifies design and reduces component count.

This unit has a pin count of 8, aligning with its SOIC-8 package design.

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