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RS PRO Lead-Free Solder Wire 0.25 mm Diameter, 217 °C Melting Point SAC305 Alloy 250g 800-7649

Category Solder Wire Brand RS PRO Condition New

Specifications

Country of Origin United States
Brand RS PRO
Model 800-7649
Melting Point 217°C
Product Weight 250g
Wire Diameter 0.25mm
Product Form Wire
Percent Lead 0%
Percent Silver 3%
Percent Tin 96.5%
Flux Type Rosin Based
Percent Copper 0.5%
RS PRO Wire, 1.01 mm Lead Free Solder, 217 °C Melting PointBrand RS PRO

Key Features

  • This solder wire contains zero percent lead to ensure RoHS compliance.
  • The rosin-based flux provides excellent wetting for PCB and component soldering.
  • The flux residue is clear and safe to leave on the circuit board after soldering.
  • Suitable for soldering both SMD and through-hole electronic components.
  • Ideal for repair, prototyping, and production soldering tasks.
  • Melting point range is between 217 and 219 degrees Celsius.
  • The solder wire flux content is approximately 3.3%.
  • Recommended soldering tip temperature ranges from 360 to 400 degrees Celsius.

Product Description

RS PRO 800-7649 is a high-quality lead-free solder wire designed for precision soldering applications in electronics manufacturing and repair, weighing 250 grams and manufactured in the United States.

The wire has a diameter of 0.25 mm and is composed of SAC305 alloy containing 96.5% tin, 3% silver, and 0.5% copper, ensuring reliable, RoHS-compliant solder joints.

With a melting point of approximately 217 °C, this solder wire melts easily and cools quickly, allowing for efficient soldering and rework of both surface-mount and through-hole components.

The rosin-based flux enhances solder flow and adhesion on common printed circuit boards, with clear flux residue that does not require cleaning after soldering.

Applications include prototyping, repair, and production environments where precise and consistent soldering is critical, particularly in the electronics assembly and manufacturing industries.

This solder wire is free of lead, promoting environmental safety and human health. Flux content of 3.3% ensures strong solder joints and clean soldering operations. The alloy conforms to industrial standards including J-STD 006 and JEIDA recommendations for lead-free soldering.

Recommended soldering iron tip temperature is between 360 and 400 °C for optimal melting and flow. The solder wire's composition offers improved performance for high-density PCB components with tight leads and spacing.

RS PRO is known for offering reliable industrial tools and materials. This lead-free Solder Wire is a dependable choice for electronics manufacturing, laboratory, repair, and similar industrial production uses.

Explore the full range of RS PRO soldering tools and materials on EnvMart for superior quality and value in your electronics assembly processes.

RS PRO Lead-Free Solder Wire 0.25 mm Diameter, 217 °C Melting Point SAC305 Alloy 250g 800-7649
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Frequently Asked Questions

The melting point of this solder wire is approximately 217 °C, making it suitable for various soldering applications.

This solder wire has a diameter of 0.25 mm, which is ideal for precision soldering tasks.

The SAC305 alloy consists of 96.5% tin, 3% silver, and 0.5% copper, ensuring reliable solder joints.

The solder wire uses a rosin-based flux, which enhances solder flow and adhesion on printed circuit boards.

Yes, this solder wire is lead-free and ensures RoHS compliance, promoting environmental safety.

The recommended soldering iron tip temperature for optimal melting and flow is between 360 and 400 °C.

This solder wire weighs 250 grams, making it suitable for various soldering tasks in electronics.

It is suitable for prototyping, repair, and production soldering tasks, especially in electronics manufacturing.

The flux content of this solder wire is approximately 3.3%, which helps ensure strong solder joints.

This solder wire is manufactured in the United States, adhering to industrial standards.

This model is suitable for soldering both surface-mount and through-hole electronic components.

No, the flux residue is clear and safe to leave on the circuit board after soldering, eliminating the need for cleaning.

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