RS PRO Heatsink for BGA Chips High-Power Electronics LEDs PCBs 10 mm x 40 mm x 40 mm Black Anodised 13.5°C/W 750-0910

RS PRO 750-0910 heatsink is engineered for thermal management in high-power electronics, BGA chips, LEDs, and printed circuit boards (PCBs). Featuring a compact form factor with dimensions measuring 10 mm in height, 40 mm in width, and 40 mm in length, this heatsink is designed to dissipate heat effectively with a thermal resistance rating of 13.5°C/W.

Made from aluminium with a black anodised finish, it combines durability and corrosion resistance for reliable long-term use. The adhesive fastening method provides a straightforward mounting solution suitable for various electronic assemblies and configurations. The heatsink is specifically compatible with BGA package types, facilitating improved thermal regulation in compact electronic devices.

This heatsink is ideal for industrial, laboratory, HVAC, manufacturing, and electronics assembly applications where precise temperature control is critical. It supports enhanced device performance and longevity by reducing thermal stress on components.

Made from aluminium with a durable black anodised surface. Efficient heat dissipation with 13.5°C/W thermal resistance. Compact 10 mm x 40 mm x 40 mm size for versatile use. Secure adhesive fastening for easy installation.

Compatible with BGA chip packages in electronic systems. Discover more Heatsink solutions at EnvMart to optimize your electronic assembly and cooling requirements.