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MG Chemicals Cold Solder Adhesive Electronic Grade Silver Conductive Epoxy 21g 8330S-21G
Specifications
| Country of Origin | Canada |
|---|---|
| Brand | MG Chemicals |
| Model | 8330S-21G |
| ANSI/ESD S20.20 | 2014 |
| BS EN 61340-5-1 | 2007 |
| Trade Name | Cold Solder |
| Easy 1 | 1 mix ratio |
Key Features
- The adhesive offers a slow cure time of 120 minutes for precision application.
- It features excellent resistance to thermal and mechanical shocks.
- Electrical resistivity is low at 0.0007 ohm-cm ensuring effective conduction.
- Thermal conductivity is rated at 1.75 W/(m·K), aiding heat dissipation.
- Suitable for bonding a wide variety of substrates used in electronic assemblies.
- Designed for use in production environments with heat-sensitive components.
- Made in Canada under controlled quality standards.
- Complies with ANSI/ESD S20.20 (2014) and BS EN 61340-5-1 (2007) standards.
Product Description
MG Chemicals 8330S-21G Cold Solder Adhesive is a high-quality, electronic grade silver conductive epoxy provided in a 21 gram quantity. This adhesive is specially formulated for bonding multiple substrates commonly used in electronic assemblies while offering outstanding resistance to thermal and mechanical shocks. It has a slow cure time of approximately 120 minutes, allowing controlled application and adjustment during assembly.
This adhesive exhibits a low electrical resistivity of 0.0007 ohm-cm, making it highly effective for electrical conduction requirements between components. In addition, it demonstrates a thermal conductivity of 1.75 W/(m·K), which helps dissipate heat from sensitive parts, reducing risk of damage in high-temperature operations.
The 8330S-21G model has been engineered to fit production settings where conventional high cure temperatures could harm delicate electronics. Its formulation allows curing without exposing components to damaging heat, thus ensuring reliability and durability.
Manufactured in Canada, this cold solder adhesive meets key industry standards including ANSI/ESD S20.20 (2014) and BS EN 61340-5-1 (2007), providing confidence in safety and performance compliance.
Common industrial applications include electronics manufacturing, repair, and prototyping where conductive joins and thermal management are essential. The adhesive can bond metals, ceramics, plastics, and other materials widely used in electrical assembly tasks.
The adhesive offers slow cure time for precision application. Excellent thermal and mechanical shock resistance ensures long-term reliability. Low electrical resistivity promotes efficient conductivity. High thermal conductivity aids in heat dissipation.
Compatible with various electronic substrates. Manufactured to industry standard compliance. Ideal for production environments with heat-sensitive components. Made in Canada. Explore more MG Chemicals adhesives and sealants on EnvMart for your industrial and electronic production needs.
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Frequently Asked Questions
The electrical resistivity of this conductive epoxy is low at 0.0007 ohm-cm, ensuring effective conduction between components.
The thermal conductivity of the 8330S-21G model is rated at 1.75 W/(m·K), which aids in heat dissipation from sensitive electronic components.
This cold solder adhesive has a slow cure time of approximately 120 minutes, allowing for controlled application during assembly.
The adhesive complies with ANSI/ESD S20.20 (2014) and BS EN 61340-5-1 (2007) standards, ensuring safety and performance compliance.
It is suitable for bonding a wide variety of substrates commonly used in electronic assemblies, including metals, ceramics, and plastics.
This product is manufactured in Canada under controlled quality standards.
Common applications include electronics manufacturing, repair, and prototyping where conductive joins and thermal management are essential.
The adhesive has an easy mix ratio of 1:1, facilitating straightforward preparation for use.
It features excellent resistance to thermal and mechanical shocks, ensuring long-term reliability in various applications.
Yes, it is designed for use in production environments with heat-sensitive components, curing without exposing them to damaging heat.
The trade name of this product is Cold Solder, reflecting its intended use in electronic applications.
The model number of this conductive epoxy is 8330S-21G, which identifies this specific formulation.
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