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| Country of Origin | China |
|---|---|
| Voltage | 1.8V |
| Brand | TE Connectivity |
| Orientation | Right Angle |
| Current | 500mA |
| Mount Type | Surface |
| Housing Material | Thermoplastic |
| Contact Material | Copper Alloy |
| Series | 1717254 |
| Termination Type | Solder |
| Maximum Operating Temperature | 85°C |
| Minimum Operating Temperature | -55°C |
| Pitch | 0.6mm |
| Row Spacing | 6.2mm |
| Contact Plating | Gold Flash |
| Number of Contacts | 200 |
| Maximum Contact Resistance | 30mΩ |
| Memory Socket Type | DIMM |
| Insertion/Removal Method | Cam-In |
| SDRAM Type | SO |
TE Connectivity 1717254-4 SO DIMM Socket is a high-quality memory connector designed for use with small outline dual in-line memory modules, providing a compact 0.6 mm pitch right angle surface mount solution.
This socket supports a voltage of 1.8V and can carry a current of 500mA, accommodating demanding electronics applications such as servers, workstations, desktop PCs, and communication equipment.
The contacts are manufactured from copper alloy with a gold flash plating to ensure minimal contact resistance and reliable electrical performance. The housing is made from thermoplastic, offering durability with a wide operating temperature range from -55°C to 85°C.
Featuring a cam-in insertion and removal mechanism combined with latching for strong mechanical retention, this socket ensures secure connection and easy module replacement. The 6.2 mm row spacing enables effective PCB layout design, supporting dense memory module arrangements.
Designed for solder termination, the socket is compatible with surface mount technology (SMT) assembly processes, making it suitable for automated manufacturing lines.
Applications include servers, high performance computing systems, mass storage devices, communication equipment, desktops, and instrument equipment, highlighting its versatility in various electronic systems.
Compatible with SO DIMM modules for compact memory applications. Gold flash plated copper alloy contacts provide reliable conductivity. Thermoplastic housing withstands harsh operating temperatures. Latching mechanism ensures secure and stable module retention.
Suitable for surface mount PCB assembly methods with solder termination. Reliable performance in high-end computing and telecom applications. This TE Connectivity memory socket is manufactured in China and adheres to quality standards suitable for industrial and commercial electronics manufacturing.
Explore more TE Connectivity memory Sockets and related components on EnvMart for diverse electronics and electrical application needs.
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