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Bergquist Thermally Conductive Double-Sided Heatsink Adhesive Tape 25 x 25 x 0.127 mm BP100-0.005-00-00-25
Specifications
| Country of Origin | United States |
|---|---|
| Brand | Bergquist |
| Model | BP100-0.005-00-00-25 |
| Accessory Type | Adhesive Tape |
| For Use With | Heatsink |
| Standards/Approvals | RoHS |
| Bergquist Heatsink Adhesive Tape for use with HeatsinkBrand | Bergquist |
Key Features
- The tape offers high bond strength even under prolonged moderate heat and high humidity conditions.
- It serves as an effective alternative to heat cure adhesives, screw mounting, and clip mounting methods.
- Specifically sized at 25 x 25 x 0.127 mm for precise heatsink attachment.
- Ideal for mounting heatsinks on BGA graphic processors and computer processors.
- Manufactured to meet RoHS and other relevant standards for electronic components.
Product Description
Bergquist BP100-0.005-00-00-25 is a thermally conductive, double-sided pressure-sensitive adhesive tape used primarily for mounting heatsinks in electronic assemblies.
This adhesive tape is engineered to maintain high bond strength during extended exposure to moderate heat and high humidity, making it suitable for demanding electronic thermal management applications.
The product dimension of 25 x 25 x 0.127 mm ensures compatibility with small heatsinks commonly used on BGA graphic processors, computer processors, and drive processors. Using this tape eliminates the need for heat cure adhesives, screw mounting, or clip mounting, thereby simplifying installation and improving reliability.
The tape complies with RoHS standards, underscoring its suitability for environmentally conscious electronic manufacturing. High bond strength under moderate heat and humidity conditions. Double-sided pressure sensitive adhesive for easy application.
Available in precise dimensions matching common heatsink sizes. Replaces traditional mechanical mounting methods effectively. RoHS compliant, supporting sustainable production requirements. This heatsink adhesive tape is widely used in electronics manufacturing, industrial automation, HVAC systems, and thermal management solutions.
Equip your systems with Bergquist adhesives for superior thermal interface solutions and reliable electronic heat dissipation performance. Explore more in the Electronics Components category at EnvMart for compatible Heatsink mounting accessories.
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Frequently Asked Questions
The adhesive tape measures 25 x 25 x 0.127 mm, making it suitable for precise heatsink attachment.
This model is primarily used for mounting heatsinks in electronic assemblies, particularly on BGA graphic processors and computer processors.
It maintains high bond strength even under prolonged exposure to moderate heat and high humidity conditions, making it effective for thermal management applications.
Yes, it complies with RoHS standards, which indicates its suitability for environmentally conscious electronic manufacturing.
It features a double-sided pressure-sensitive adhesive, allowing for easy application and effective mounting.
This tape serves as an alternative to heat cure adhesives, screw mounting, and clip mounting methods, simplifying installation.
It is specifically designed for use with heatsinks, making it compatible with various heatsink mounting applications in electronics.
The tape is manufactured in the United States.
It is widely used in electronics manufacturing, industrial automation, HVAC systems, and thermal management solutions.
The model number of this adhesive tape is BP100-0.005-00-00-25.
The tape is engineered to maintain high bond strength during extended exposure to moderate heat and high humidity.
Yes, its RoHS compliance supports sustainable production requirements in electronic manufacturing.
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