Infineon Thyristor Module 1800 V 9.5 kA 380 A 150 mA 1.47 V 7-Pin TD390N18SOFHPSA1

Infineon TD390N18SOFHPSA1 Thyristor Module is engineered for high power industrial and electronic applications requiring reliable phase control and switching capabilities. This second-generation module is housed in a compact 50 mm prime block offering increased current rating with a rated average on-state current of 380 A and a high repetitive peak reverse voltage of 1800 V. It supports a surge current rating of 9.5 kA, making it suitable for demanding transient conditions in industrial power systems.

This thyristor module employs solder bond technology, ensuring high mechanical integrity and long operational lifetime from its robust build quality. The device incorporates a solid base plate which offers rapid and secure mounting to heatsinks, facilitating optimized thermal management even with less efficient heat dissipation hardware.

Featuring a 7-pin configuration, the module supports electrical connections optimized for phase control with precise gate trigger characteristics - a maximum gate trigger current of 150 mA and a voltage of 2 V. The operating temperature is rated up to 140°C, making it suitable for applications exposed to elevated thermal environments.

Due to its industrial standard package and reliable performance, this thyristor module finds use in industrial automation, power supply units, motor controls, and other heavy-duty semiconductor applications where dependable switching and phase control are essential.

This Thyristor Module supports 1800 V repetitive peak reverse voltage. Rated average on-state current is 380 A for robust load handling. Surge current rating of 9.5 kA ensures durability under transient conditions. Equipped with 7 pins for reliable electrical connections.

Maximum gate trigger current is 150 mA for precise triggering control. Maximum gate trigger voltage is 2 V to optimize gate signal requirements. Operating temperature can reach up to 140°C ensuring high thermal tolerance.

Designed with solder bond technology for enhanced mechanical strength. Optimized solid base plate enables fast and easy mounting on heat sinks. The module features industrial standard packaging suited for harsh environments.

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