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MG Chemicals Silver Conductive Epoxy Adhesive Super Glue Syringe 14.4 g 8331D-14G

Category Adhesives & Glues Brand MG Chemicals Condition New

Specifications

Country of Origin Canada
Brand MG Chemicals
Model 8331D-14G
Package Type Syringe
Sub Type Epoxy Adhesive
Package Size 14.4 g
For Use With Conductive Connections, Cold-Soldering, Seam Fill, EMI/RFI shielding
Trade Name Silver Conductive
Cure Time 65 min
MG Chemicals 8331 Liquid Adhesive, 14 gBrand MG Chemicals

Key Features

  • This epoxy adhesive offers high electrical conductivity for reliable connections.
  • It cures at room temperature with a working time of 20 minutes and a cure time of 6 hours.
  • Faster curing is possible at 65 °C within 10 minutes for accelerated processes.
  • The adhesive creates strong, permanent electrical bonds without soldering.
  • Ideal for bonding heat-sensitive electronic components and materials such as glass, soft metals, and plastics.
  • Applications include seam filling and EMI/RFI shielding where soldering may be unsuitable.
  • Manufactured in Canada ensuring high quality and consistency.

Product Description

MG Chemicals 8331D-14G Silver Conductive Epoxy Adhesive Super Glue is a high-quality electrically conductive adhesive supplied in a 14.4 g syringe. It serves as an efficient solder replacement epoxy, enabling cold-soldering repairs and conductive connections where traditional soldering is unsuitable or could damage heat-sensitive electronic components.

This product features a precise 1:1 mix ratio, making preparation simple and consistent. It offers a working time of approximately 20 minutes at room temperature and cures fully within 6 hours under ambient conditions. For enhanced productivity, accelerated curing can be achieved by heating to 65 °C for 10 minutes, facilitating faster assembly workflows.

The adhesive establishes robust, permanent electrical connections with excellent conductivity, ideal for bonding surfaces such as glass, soft metals, and plastics. These properties make it suitable for applications including seam filling, cold-soldering, and EMI/RFI shielding in industrial, electronics, laboratory, manufacturing, and repair environments.

Packaged as a convenient syringe applicator, this epoxy adhesive ensures precise and controlled dispensing during intricate repair or assembly tasks. Its formulation minimizes the risk of component damage while providing reliable conductive pathways.

High electrical conductivity for durable connections. 1:1 mix ratio simplifies application. 20 minutes working time at room temperature. 6 hours room temperature cure; 10 minutes at 65 °C cure. Strong permanent electrical bonds without soldering.

Suitable for heat-sensitive electronic components. Ideal for bonding glass, soft metals, and plastics. Effective for seam fill and EMI/RFI shielding applications.

Manufactured in Canada, MG Chemicals provides this product with consistent quality aimed at industrial, manufacturing, laboratory, and electronics repair professionals requiring dependable conductive adhesives. Explore more adhesives and conductive solutions from MG Chemicals at EnvMart's Adhesives & Glues category.

Explore more products in our Adhesives & Glues category.

MG Chemicals Silver Conductive Epoxy Adhesive Super Glue Syringe 14.4 g 8331D-14G
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Frequently Asked Questions

The working time for this epoxy adhesive is approximately 20 minutes at room temperature.

It fully cures within 6 hours at room temperature, or in 10 minutes when heated to 65 °C.

The adhesive features a precise 1:1 mix ratio, simplifying the preparation process.

It is suitable for bonding glass, soft metals, and plastics.

This adhesive is ideal for conductive connections, cold-soldering, seam filling, and EMI/RFI shielding.

The adhesive is packaged in a convenient 14.4 g syringe for precise dispensing.

It is manufactured in Canada, ensuring consistent quality.

It is an epoxy adhesive known for its high electrical conductivity.

The trade name of this adhesive is Silver Conductive.

It provides strong, permanent electrical bonds without soldering, minimizing the risk of damage to heat-sensitive components.

It is intended for applications requiring reliable electrical connections in industrial, electronics, laboratory, manufacturing, and repair environments.

Yes, accelerated curing can be achieved at 65 °C within 10 minutes.

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