Infineon NOR 256 MB SPI Flash Memory 16-Pin SOIC S25FL256SAGBHBA00

Infineon S25FL256SAGBHBA00 is a high-capacity NOR SPI Flash Memory with 256 MB storage, presented in a 16-pin SOIC surface-mount package. It features synchronous SPI interface allowing versatile communication modes including Single I/O (SIO), Dual I/O (DIO), and Quad I/O (QIO), and supports DDR read commands to transfer data on both clock edges, enhancing throughput.

This device operates at voltages ranging from 2.7V to 3.6V, making it suitable for low power embedded systems. With a maximum clock frequency of 133 MHz, it ensures rapid data access and transfer, optimizing performance in demanding applications. The compact physical dimensions of 10.3 mm length, 7.5 mm width, and 2.55 mm height facilitate space-saving designs.

Designed for industrial and automotive use, it meets the AEC-Q100 automotive standard and operates within a wide temperature range of -40°C to 85°C. The Eclipse architecture incorporates a page programming buffer for faster programming and erase operations, contributing to efficient memory management.

Execute-In-Place (XIP) functionality allows direct code execution from the flash memory, especially beneficial for code shadowing applications. This memory is ideal for embedded designs requiring reliable, high-speed, and flexible flash storage solutions.

Applications include embedded automotive control, industrial automation, consumer electronics, and other environments requiring durable and fast flash memory components. The 16-pin SOIC package allows easy PCB mounting through surface mount technology.

This memory device offers 256 MB storage capacity with a 16-pin SOIC package. It supports SPI multi-I/O commands including Single I/O, Dual I/O, and Quad I/O for flexible communication. The maximum clock frequency is 133 MHz, allowing fast data transfer rates.

Operating voltage ranges from 2.7V to 3.6V ensuring compatibility with various systems. Operating temperature range is from -40°C to 85°C, suitable for automotive and industrial environments. The device supports execute-in-place (XIP) with DDR read commands for high-speed code access.

Dimensions are compact with length 10.3 mm, width 7.5 mm, and height 2.55 mm. Meets AEC-Q100 automotive standards for reliability. Ideal for code shadowing, XIP applications, and data storage in embedded systems. Explore the extensive range of semiconductor devices and Flash Memory components at EnvMart for cutting-edge embedded solutions.