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TE Connectivity AMP Guide for use with VITA 46 3U & 6U 9mm Daughtercard 1-1469492-9
Specifications
| Country of Origin | India |
|---|---|
| Brand | TE Connectivity |
| Material | Zinc Alloy |
| Colour | Silver |
| Series | AMP |
| Accessory Type | Guide |
| For Use With | VITA 46 3U & 6U 9mm Daughtercard |
| Standards/Approvals | EU ELV 2000/53/EC, EU RoHS 2011/65/EU |
Key Features
- Compatible with VITA 46 3U and 6U 9mm daughtercards.
- Constructed from durable zinc alloy with a silver finish for corrosion resistance.
- Right-angle mounting design for precise installation.
- Complies with EU ELV 2000/53/EC and EU RoHS 2011/65/EU standards.
- Part of the AMP series known for high-quality backplane connectivity.
- Ideal for use in computer, communications, military, medical, and industrial control industries.
- Offers superior signal integrity and mechanical stability on the backplane interface.
Product Description
TE Connectivity 1-1469492-9 AMP Guide for use with VITA 46 3U & 6U 9mm Daughtercard is an essential connector accessory manufactured from zinc alloy with a silver finish, providing high durability and corrosion resistance. This guide is specifically designed for use with VITA 46 3U and 6U 9mm daughtercards, offering precise right-angle mounting to ensure optimal alignment and mechanical stability.
The product forms part of the AMP series, a flexible and customizable backplane interconnect family widely used in advanced electronic systems across computer, communications, military, medical, and industrial control environments. It supports the Multigig 9.0 VITA 46 platform, providing superior signal integrity and impedance-matched interfaces.
Manufactured in compliance with EU ELV 2000/53/EC and EU RoHS 2011/65/EU standards, this guide module meets stringent environmental and safety regulations. The zinc alloy material combined with the silver finish not only enhances durability but also supports robust mechanical performance through repeated mating cycles.
Suitable for applications requiring high-density, high-speed data transfer on backplanes, this accessory aids in achieving reliable and efficient electronic system assembly. Compatible mounting screws and guide pins are available separately.
Compatible with VITA 46 3U & 6U 9mm daughtercards. Zinc alloy construction with silver finish for corrosion resistance. Right-angle mounting for exact positioning in backplane assemblies. Compliant with EU ELV and RoHS regulations ensuring environmental safety.
Part of the versatile AMP series supporting advanced backplane systems. Offers high durability and mechanical stability in demanding industrial contexts. Customizable key orientations available for specific design needs.
This TE Connectivity AMP Guide is a vital component for engineers and designers in industrial, military, and medical electronics seeking reliable backplane interconnect solutions. Explore more PCB DIN Connector Accessories on EnvMart for comprehensive system integration.
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Frequently Asked Questions
It is constructed from zinc alloy with a silver finish, providing durability and corrosion resistance.
This guide is specifically designed for use with VITA 46 3U and 6U 9mm daughtercards.
It complies with EU ELV 2000/53/EC and EU RoHS 2011/65/EU standards, ensuring environmental safety and compliance.
It features a right-angle mounting design for precise installation and optimal alignment in backplane assemblies.
This guide is part of the AMP series, known for its high-quality backplane connectivity solutions.
It is suitable for applications in computer, communications, military, medical, and industrial control industries.
It provides superior signal integrity and impedance-matched interfaces, which are crucial for high-density, high-speed data transfer.
Compatible mounting screws and guide pins are available separately for use with this guide.
The country of origin for this guide is India.
The zinc alloy construction combined with a silver finish enhances durability and supports robust mechanical performance through repeated mating cycles.
It is designed for applications requiring reliable and efficient electronic system assembly, particularly in high-speed data transfer contexts.
Yes, customizable key orientations are available for specific design requirements.
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