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Loctite Self-Adhesive Thermal Conductive Pad 0.127 mm Thick, 1.6 W/mK Polyamide BERGQUIST HI FLOW THF 1600P

Category Thermal Pads Brand Loctite Condition New

Specifications

Country of Origin United States
Brand Loctite
Colour Green
THICKNESS 0.127mm
Model Bergquist Hi Flow THF 1600P
Maximum Operating Temperature 150°C
Thermal Conductivity 1.6W/mK
Minimum Operating Temperature 55°C
Standards/Approvals ASTM D3418, ASTM D882A, UL 94 V-0, ASTM D257, ASTM D149, ASTM D150, ASTM D5470, ASTM D374
Trade Name BERGQUIST HI FLOW THF 1600P
Conductive Material Polyamide

Key Features

  • This thermal pad features a durable polyamide conductive material suitable for efficient heat dissipation.
  • The pad supports a maximum operating temperature of 150°C and a minimum operating temperature of -55°C for reliable performance in harsh conditions.
  • Adhesive backing allows for simple installation and effective surface contact.
  • It boasts excellent dielectric properties and superior cut-through resistance for safe use in electronics applications.
  • Complies with multiple industry standards, including ASTM D3418, ASTM D882A, UL 94 V-0, ASTM D257, ASTM D149, ASTM D150, ASTM D5470, and ASTM D374.
  • The pad is green in color, providing easy visual identification and quality assurance.
  • Manufactured in the United States to high quality standards, ensuring consistency and reliability.

Product Description

Loctite Bergquist Hi Flow THF 1600P self-adhesive thermal conductive pad is a precision-engineered heat transfer solution designed with a 0.127 mm thickness and rated to 1.6 W/mK thermal conductivity. This polyamide-based conductive material features an advanced thermally conductive phase change compound that enhances heat dissipation efficiency and electrical insulation.

Ideal for industrial, electronics manufacturing, HVAC, and thermal management applications, this thermal pad withstands a wide temperature range from -55°C to 150°C. Its excellent dielectric performance and superior cut-through resistance make it a reliable component for high-stress environments.

Key technical certifications include ASTM D3418, ASTM D882A, UL 94 V-0, ASTM D257, ASTM D149, ASTM D150, ASTM D5470, and ASTM D374 standards, confirming the product's compliance for safety and performance requirements.

The green-colored polyamide pad is self-adhesive, facilitating easy installation on heat-sensitive electronic components, ensuring optimal thermal interface contact and protection.

Manufactured in the United States, this thermal pad represents a trusted solution for demanding electronics cooling challenges and industrial thermal management. This thermal pad features a durable polyamide conductive material suitable for efficient heat dissipation.

The pad supports a maximum operating temperature of 150°C and a minimum operating temperature of -55°C for reliable performance in harsh conditions. Adhesive backing allows for simple installation and effective surface contact.

It boasts excellent dielectric properties and superior cut-through resistance for safe use in electronics applications. Complies with multiple industry standards, including ASTM D3418, ASTM D882A, UL 94 V-0, ASTM D257, ASTM D149, ASTM D150, ASTM D5470, and ASTM D374.

The pad is green in color, providing easy visual identification and quality assurance. Manufactured in the United States to high quality standards, ensuring consistency and reliability. Explore more Thermal Pads and thermal interface materials at EnvMart for advanced electronics and industrial thermal management solutions.

Loctite Self-Adhesive Thermal Conductive Pad 0.127 mm Thick, 1.6 W/mK Polyamide BERGQUIST HI FLOW THF 1600P
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Frequently Asked Questions

The thermal conductivity of this thermal pad is rated at 1.6 W/mK, allowing for efficient heat dissipation.

This model supports a maximum operating temperature of 150°C and a minimum operating temperature of -55°C, making it suitable for harsh environments.

The pad is made from a polyamide conductive material, designed for effective thermal management.

The thickness of this thermal pad is 0.127 mm, providing a compact solution for thermal interface applications.

The pad is green in color, which allows for easy visual identification and quality assurance during installation.

It complies with several industry standards, including ASTM D3418, ASTM D882A, UL 94 V-0, ASTM D257, ASTM D149, ASTM D150, ASTM D5470, and ASTM D374.

Yes, the thermal pad features an adhesive backing that allows for simple installation and effective surface contact.

This model is ideal for industrial, electronics manufacturing, HVAC, and thermal management applications.

It is manufactured in the United States, ensuring high quality standards and consistency.

The pad boasts excellent dielectric properties, making it safe for use in electronics applications.

This thermal pad has superior cut-through resistance, which enhances its reliability in high-stress environments.

The trade name of this thermal pad is BERGQUIST HI FLOW THF 1600P, reflecting its specific product line.

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