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| Country of Origin | China |
|---|---|
| Brand | RS PRO |
| Colour | Grey |
| THICKNESS | 1.5mm |
| Length | 200mm |
| Model | 174-5716 |
| Width | 200mm |
| Series | RS PRO |
| Maximum Operating Temperature | 125°C |
| Hardness | 45 Shore Oo |
| Thermal Conductivity | 3W/mK |
| Minimum Operating Temperature | -40°C |
| Standards/Approvals | REACH, RoHS |
| Trade Name | Non-Silicone Thermal Interface Pad |
| Conductive Material | Non-Silicone |
RS PRO 174-5716 is a self-adhesive thermal gap pad designed for effective heat transfer and electrical insulation in electronics assembly. This non-silicone thermal interface pad features a thickness of 1.5 mm and measures 200 mm by 200 mm, providing precision fit for managing heat dissipation gaps.
The pad's thermal conductivity rating of 3 W/mK facilitates efficient heat transfer from electronic components to heatsinks, protecting PCBs and electronics from overheating and damage.
Constructed from non-silicone material with a hardness of 45 Shore OO, it remains durable and compliant with REACH and RoHS standards, ensuring environmental safety.
The self-adhesive backing simplifies installation, making it suitable for use across industrial electronics, power supply units, consumer devices, and automotive control units where gap filling and thermal management are critical.
Made from non-silicone material for reliable thermal insulation. Dimensions of 200 mm length, 200 mm width, and 1.5 mm thickness. Thermal conductivity rating of 3 W/mK improves heat dissipation. Grey colored pad with hardness rating of 45 Shore OO for durability.
Self-adhesive surface enables easy installation on uneven surfaces. Operating temperature range from -40°C to 125°C for diverse applications. Complies with REACH and RoHS environmental standards.
This thermal pad is widely used in industrial, electronics, and automotive manufacturing sectors for efficient thermal management and electrical insulation. Explore more RS PRO products in Thermal Pads category at EnvMart for reliable electronic component solutions.
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