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Ezurio Sterling LWB5+ WiFi 5 + Bluetooth 5.2 Development Module USB Adapter LWB5
Specifications
| Country of Origin | China |
|---|---|
| Brand | Ezurio |
| Model | LWB5 |
| Technology | Bluetooth Module |
| Maximum Frequency | 5GHz |
| Kit Classification | Development Module, Bluetooth Development Tools |
| Featured Device | Module |
| Kit Name | Sterling LWB5+ WiFi 5 + Bluetooth 5.2 Module/USB Adapter |
| RF Technology | Bluetooth |
Key Features
- The module integrates WLAN (802.11 a/b/g/n/ac) and dual-mode Bluetooth 5.2 low energy functionality within a compact form factor.
- Designed for flexible platform-specific customization with integrated RF paths including diplexer, switches, crystal oscillator, and power management units.
- Includes selectable integrated ceramic chip antenna, MHF4 RF connector, or RF trace pad variants.
- Operates reliably over a temperature range of -40° to +85°C and humidity range of 10 to 90% non-condensing.
- Supports maximum frequency of 5 GHz for high-speed wireless connectivity.
- Meets moisture sensitivity level 4 and withstands electrostatic discharge levels of 4KV (conductive) and 8KV (air coupled).
- Compact and pre-calibrated for cost-effective and simple implementation in communication and wireless development applications.
- Ideal for integration in low-power mobile, industrial, laboratory, and communication development environments.
Product Description
Ezurio Sterling LWB5+ WiFi 5 + Bluetooth 5.2 Development Module USB Adapter (Model LWB5) is a cutting-edge wireless communication solution tailored for development and prototyping in communication and wireless applications.
This compact module integrates 1x1 SISO 802.11 a/b/g/n/ac WLAN capabilities along with dual-mode Bluetooth 5.2 low energy support, optimized for low-power mobile devices. The module is pre-calibrated, facilitating easy integration with platform-specific customization through its embedded transmit and receive RF paths, including diplexer, switches, reference crystal oscillator, and power management units.
Variants offer connectivity through an integrated ceramic chip antenna, MHF4 RF connector, or RF trace pad, providing flexibility for diverse application needs. Operating reliably within temperatures ranging from -40° to +85°C and humidity conditions of 10 to 90% (non-condensing), this module is suitable for demanding environments in industrial, laboratory, manufacturing, and communication development sectors.
The module supports a maximum operating frequency of 5 GHz, ensuring high-speed wireless communication. It also conforms to moisture sensitivity level 4 and withstands electrostatic discharge levels of 4KV conductive and 8KV air coupled, enhancing robustness for embedded development applications.
The module integrates WLAN and Bluetooth functionalities in a single small form-factor component. Provides low power consumption optimized for mobile device applications. Includes flexible antenna and connector options for diverse usage scenarios.
Maintains performance across wide temperature and humidity ranges. Pre-calibrated with embedded RF paths and power management. Supports 5GHz frequency bands for WiFi 5 connectivity. Designed for development, prototyping, and evaluation of Bluetooth and WiFi enabled devices.
Meets rigorous electrostatic and moisture sensitivity standards for enhanced durability.
This development module is ideal for developers and engineers working on IoT, communication systems, embedded wireless devices, and other innovative technology projects requiring reliable WiFi 5 and Bluetooth 5.2 connectivity.
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Frequently Asked Questions
This model integrates WLAN (802.11 a/b/g/n/ac) and dual-mode Bluetooth 5.2 low energy functionality.
The module supports a maximum operating frequency of 5 GHz, ensuring high-speed wireless connectivity.
It operates reliably over a temperature range of -40° to +85°C, making it suitable for demanding environments.
The device can operate in humidity conditions of 10 to 90% non-condensing.
It withstands electrostatic discharge levels of 4KV (conductive) and 8KV (air coupled).
It includes selectable integrated ceramic chip antenna, MHF4 RF connector, or RF trace pad variants for flexible connectivity.
The module is manufactured in China.
It is ideal for integration in low-power mobile, industrial, laboratory, and communication development environments.
Yes, it includes integrated power management units to optimize performance for embedded applications.
Yes, the module is pre-calibrated, facilitating easy integration with platform-specific customization.
It is classified as a development module and Bluetooth development tool.
It supports development, prototyping, and evaluation of Bluetooth and WiFi enabled devices.
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