High Precision Material Thermal Conductivity Coefficient Tester (Plate Heat Flow Meter Method) TCM-RPL-III

High Precision Material Thermal Conductivity Coefficient Tester (Plate Heat Flow Meter Method), TCM-RPL-III, Adopt internationally popular heat flow meter thermal conductivity coefficient and thermal resistance detection methods, with a computer to realize automatic. Detection, generate test reports. The instrument adds stable thermal surface temperature on one side of the sample, heat goes through the sample to deliver to the cold side to detect transferred heat flow to calculate the thermal conductivity and thermal resistance. It adopts imported sensors and computer technology, good measurement accuracy, high reliability, and good repeatability. Particularly suitable for low thermal conductivity measurement (accuracy to 0.1mw)