Thermal Conductivity Tester (Heat Flow Method) TCM-DRL-III

Thermal Conductivity Tester (Heat Flow Method), TCM-DRL-III, The instrument is the main test thin thermal conductor, solid electric insulation materials, heat conduction silicon grease, resin, rubber, beryllium oxide porcelain, alumina ceramics of material, such as thermal resistance and solid interface in thermal contact resistance and the thermal conductivity of materials. Test materials for solid flake, add around the box can detect the powder materials and paste material state