Multi-function Fast Thermal Conductivity Tester (Transient Plane Heat Source Method Hotdisk Method) TCM-DRE-III
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Multi-function Fast Thermal Conductivity Tester (Transient Plane Heat Source Method Hotdisk Method) TCM-DRE-III
Specifications
Model | TCM-DRE-III |
---|---|
Power Supply | AC 220V +- 10% 50/60 Hz the whole power Less Than 500w |
Thermal conductivity measurement range | 0.005~100 w/ (m.k) |
Measurement time | 1 ~ 120 seconds |
Thermal resistance range | 0.5~0.000005 m2.k/w |
Measuring temperature range | room temperature ~ 120 Degree C |
Measure the relative error | Less Than - 3% |
Key Features
- Mainly measure the thermal conductivity, temperature coefficient (thermal diffusivity) and specific heat, heat storage coefficient and thermal resistance of solid, rock and soil, powder, liquid, paste, coating, film and anisotropic materials
Product Details
Multi-function Fast Thermal Conductivity Tester (Transient Plane Heat Source Method, Hotdisk Method), TCM-DRE-III, This series of Thermal conductivity instrument uses transient plane heat source method, the instrument based on TPS transient plane heat source technology, with Hot Disk as the probe thermal conductivity tester. The hot Disk method has the following advantages:(1) direct measurement of heat transfer, you can save a lot of time;(2) will not be the same as the static method by the impact of thermal resistance;(3) No special sample preparation is required, for the solid material, only need the relatively flat surface of the sample. It has the advantages of fast measurement speed, wide application range, and the ability to successfully avoid the influence of natural convection during the experiment. It is the popular test method. Equipment reference standard: ISO 22007-2 2008Composite materials: glass composite CRC, cement enhanced polyphony board, sandwich concrete, fiberglass panel composite plate, paper cellular plate
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