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Wurth Elektronik WE-TGF Series Thermal Gap Pad 3mm Thickness, 6 W/mK, Ceramic Filled Silicone Rubber, 400mm x 200mm 40006030
Specifications
| Country of Origin | India |
|---|---|
| Brand | Wurth Elektronik |
| Colour | Grey |
| THICKNESS | 3mm |
| Length | 400mm |
| Model | 40006030 |
| Width | 200mm |
| Series | WE-TGF |
| Maximum Operating Temperature | 150°C |
| Hardness | 35 Shore C |
| Thermal Conductivity | 6W/mK |
| Minimum Operating Temperature | -50°C |
| Standards/Approvals | Halogen Free, REACH, RoHS |
| Trade Name | Würth Elektronik |
| Conductive Material | Ceramic Filled Silicone Rubber |
Key Features
- Provides high thermal conductivity for efficient heat transfer in electronic devices.
- 3 mm thick pad ensures reliable gap filling in heatsink and electronics assemblies.
- Ceramic filled silicone rubber for durable performance and insulation.
- Operating temperature range from -50°C up to +150°C for versatile industrial and electronics use.
- Hardness rating of 35 Shore C offers firmness while maintaining flexibility.
- Halogen free, REACH and RoHS compliant for safe and environmentally responsible use.
- Grey colour for easy visual identification in assemblies.
Product Description
Wurth Elektronik 40006030 WE-TGF Series Thermal Gap Pad offers high-performance thermal interface material designed for demanding applications requiring effective heat management. This pad is 3 mm thick, provides exceptional thermal conductivity of 6 W/mK, and is made from ceramic filled silicone rubber. It easily conforms to surface irregularities, filling air gaps and uneven textures between heatsinks and electronic components, greatly enhancing heat dissipation efficiency.
The pad measures 400 mm in length and 200 mm in width, making it ideal for larger electronics and heat sink coverage. Its hardness of 35 Shore C ensures firm yet flexible placement, absorbing surface inconsistencies while maintaining thermal contact.
High thermal conductivity for optimized heat transfer and device reliability. 3 mm thick construction enables gap filling for various surface profiles. Ceramic filled silicone rubber delivers durable mechanical and electrical insulation.
Dimensions fit wide coverage areas, suitable for industrial, electronics manufacturing, and HVAC thermal management. Wide operating temperature -50°C to +150°C allows usage in extreme environments. Halogen free, REACH and RoHS compliant for compliance with industrial safety standards.
Grey colour for clear identification during installation and quality checks.
This thermal gap pad is particularly useful in electronics, industrial automation, manufacturing, HVAC, and power equipment, where precise thermal management is essential. Applications include heatsink assembly, circuit board protection, motor driver cooling, and electronics enclosure thermal control.
Suitable for industrial and laboratory applications, this pad enables greater performance and lifespan of devices through improved thermal interface reliability. The WE-TGF series represents Wurth Elektronik's commitment to quality, safety, and technical innovation in thermal management solutions.
Browse more Wurth Elektronik thermal interface solutions and advanced electronics components on EnvMart.
Explore more products in our Thermal Interface Sheet category.
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Frequently Asked Questions
The thermal conductivity of this thermal gap pad is 6 W/mK, which enables efficient heat transfer in electronic devices.
The pad measures 400 mm in length and 200 mm in width, making it suitable for larger electronics and heat sink coverage.
This model has a thickness of 3 mm, allowing it to effectively fill gaps and conform to surface irregularities.
The operating temperature range is from -50°C to +150°C, making it versatile for various industrial and electronics applications.
It is made from ceramic filled silicone rubber, which provides both mechanical and electrical insulation.
The hardness rating is 35 Shore C, ensuring firmness while maintaining flexibility for effective thermal contact.
Yes, it is halogen free and compliant with REACH and RoHS standards, ensuring safe and environmentally responsible use.
It is suitable for applications such as heatsink assembly, circuit board protection, motor driver cooling, and electronics enclosure thermal control.
Yes, it can be used in HVAC thermal management due to its effective heat transfer capabilities and wide operating temperature range.
The pad is grey in color, which aids in visual identification during installation and quality checks.
The country of origin for this product is India.
The purpose is to enhance heat dissipation efficiency by filling air gaps and uneven textures between heatsinks and electronic components.
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