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RS PRO Lead Solder Wire 1.01 mm Diameter 60% Tin 40% Lead Rosin Based Flux 183 °C Melting Point 500g 800-7646

Category Solder Wire Brand RS PRO Condition New

Specifications

Country of Origin United States
Brand RS PRO
Model 800-7646
Melting Point 183°C
Product Weight 500g
Wire Diameter 1.01mm
Product Form Wire
Percent Lead 40%
Percent Tin 60%
Flux Type Rosin Based
MBO Wire, 1 mm Lead Solder, 183 °C Melting PointBrand MBO
Felder Lottechnik Wire, 1 mm Lead Solder, 183 °C Melting PointBrand Felder Lottechnik
RS PRO Wire, 1.27 mm Lead Solder, 183 °C Melting PointBrand RS PRO
Stannol Wire, 1mm Lead solder, 183°C Melting PointBrand Stannol

Key Features

  • Composed of 60% tin and 40% lead alloy for optimal soldering performance.
  • Rosin-based flux ensures excellent wetting on common printed circuit boards.
  • 500 grams wire form suitable for various soldering tasks.
  • Melting point range between 183 and 188 °C allows easy melting and quick solidification.
  • Clear soldering residue that can safely remain on PCBs after soldering.
  • Typical soldering iron temperature between 320 and 360 °C recommended.
  • Ideal for securing electrical components on integrated circuits and circuit boards.
  • Supports reworkability due to its relatively low melting point.

Product Description

RS PRO 800-7646 Lead Solder Wire with 1.01 mm diameter and 60/40 tin/lead composition offers reliable soldering performance for industrial, electronic, and repair applications. The rosin-based flux promotes effective wetting on various printed circuit boards and components, ensuring high-quality joints.

With a melting point of 183 °C, this solder wire melts quickly under recommended iron tip temperatures of 320-360 °C, allowing precise and quick joints formation. The clear residue left after soldering is safe to remain on PCBs, reducing the need for post-cleaning.

This product is supplied in a convenient 500 g spool form, suitable for both professional and hobbyist soldering tasks. It excels in securing electrical components in integrated circuits through reliable solder joints. Thanks to its low melting point, it enables easy reworking and removal if necessary.

The solder wire complies with J-STD 006 alloy standards for quality assurance. It is suited for a wide range of soldering uses including repair, prototyping, and production in electronics manufacturing and maintenance.

The advantages of this lead solder include lower melting temperatures for gentler handling of sensitive components and boards, compared to lead-free alternatives. However, users should consider environmental and safety guidelines when using lead-based solder.

Composed of 60% tin and 40% lead alloy for optimal soldering performance. Rosin-based flux ensures excellent wetting on common printed circuit boards. 500 grams wire form suitable for various soldering tasks. Melting point range between 183 and 188 °C allows easy melting and quick solidification.

Clear soldering residue that can safely remain on PCBs after soldering. Typical soldering iron temperature between 320 and 360 °C recommended. Ideal for securing electrical components on integrated circuits and circuit boards.

Supports reworkability due to its relatively low melting point. Widely used in repair, prototyping, and production with both SMD and through-hole components. Explore the RS PRO range in the Solder Wire category for quality, reliability, and value.

RS PRO Lead Solder Wire 1.01 mm Diameter 60% Tin 40% Lead Rosin Based Flux 183 °C Melting Point 500g 800-7646
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Frequently Asked Questions

The solder wire has a melting point range between 183 °C and 188 °C, allowing for easy melting and quick solidification during soldering tasks.

This model is composed of 60% tin and 40% lead, which contributes to its optimal soldering performance.

The solder wire is supplied in a spool weighing 500 grams, suitable for various soldering tasks.

The wire diameter of this solder is 1.01 mm, making it suitable for a range of soldering applications.

It uses a rosin-based flux, which ensures excellent wetting on common printed circuit boards and components.

The typical soldering iron temperature recommended for this model is between 320 °C and 360 °C.

This solder wire is widely used in repair, prototyping, and production applications in electronics manufacturing and maintenance.

Yes, it leaves a clear soldering residue that can safely remain on printed circuit boards after soldering, reducing the need for post-cleaning.

This product complies with J-STD 006 alloy standards for quality assurance in soldering materials.

This lead solder has a lower melting point compared to lead-free alternatives, which allows for gentler handling of sensitive components and boards.

The solder wire is manufactured in the United States.

It is ideal for securing electrical components on integrated circuits and circuit boards, ensuring reliable solder joints.

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