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Weller 0.8 mm Lead Free Solder Wire, Rosin Flux, 217°C Melting Point, 250g Spool T0051388799

Category Solder Wire Brand WELLER Condition New

Specifications

Country of Origin Japan
Brand Weller
Model T0051388799
Melting Point 217°C
Product Weight 250g
Wire Diameter 0.8mm
Product Form Wire
Percent Lead 0%
Percent Silver 3%
Percent Tin 96.5%
Flux Type Rosin
Percent Copper 0.5%
RS PRO Wire, 0.8 mm Lead Free Solder, 227 °C Melting PointRS Stock No. 818-3204Brand: RS PRO

Key Features

  • The wire is composed of 96.5% tin, 3% silver, and 0.5% copper, delivering strong, fatigue-resistant solder joints.
  • Operates with a rosin flux for stable flux activity, reducing oxidation during soldering.
  • Has a melting point of 217°C, enabling controlled thermal profiling suitable for manual and machine soldering.
  • Ideal for through-hole components, sensor modules, connectors, and cable terminations in electrical and automation assemblies.
  • The spool should be stored dry and sealed to maintain flux effectiveness and alloy surface condition.
  • The 0.8 mm wire diameter allows precise manual and machine feeding.
  • Silver content enhances creep resistance for durability during thermal cycling.
  • Copper addition minimizes internal voids in soldered joints.

Product Description

Weller T0051388799 is a 0.8 mm diameter lead free solder wire manufactured in Japan, weighing 250 g. It is designed for electronic assembly and repair, providing a reliable rosin-fluxed alloy suitable for electrical and mechanical component joining requiring lead-free materials.

This Solder Wire contains 96.5% tin, 3% silver, and 0.5% copper, which improves wetting performance, joint strength, fatigue resistance, and reduces voiding in solder joints. The melting point is 217°C, supporting predictable thermal profiling for both hand soldering and automated processes.

The built-in rosin flux supports stable solder flow while minimizing oxide formation on joints. This wire is compatible with manual iron soldering, wave soldering, and selective soldering methods when thermal profiles are correctly applied.

Applications include through-hole component soldering on control boards, repair and rework of electronic assemblies, small-batch production with pick-and-place feeders, assembly of sensor modules for automation systems, and soldering connectors and cable terminations in electrical panels.

To preserve performance, unused spools should be kept dry, sealed, and stored away from corrosive atmospheres. This ensures stable flux activity and surface integrity of the solder alloy.

The 0.8 mm wire diameter allows precise manual and machine feeding. The 96.5% tin rich composition enables excellent wetting for effective solder joints. Silver content enhances creep resistance for durability during thermal cycling.

Copper addition minimizes internal voids in soldered joints. The 217°C melting point supports consistent reflow with reduced oxidation. Rosin flux promotes reliable fluxing behavior suited for various soldering processes.

This product is valuable for industrial, laboratory, electrical repair, manufacturing, and automation sectors requiring lead-free soldering solutions. Browse EnvMart for more Weller soldering tools and accessories.

Weller 0.8 mm Lead Free Solder Wire, Rosin Flux, 217°C Melting Point, 250g Spool T0051388799
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Frequently Asked Questions

The melting point of this solder wire is 217°C, which supports predictable thermal profiling for soldering processes.

This solder wire has a diameter of 0.8 mm, allowing for precise manual and machine feeding during soldering.

The solder wire is composed of 96.5% tin, 3% silver, and 0.5% copper, which enhances joint strength and reduces voiding in soldered joints.

It uses rosin flux, which supports stable solder flow and minimizes oxide formation on joints during soldering.

This solder wire is manufactured in Japan.

The solder wire spool weighs 250 g.

This solder wire is suitable for through-hole component soldering, electronic assembly repair, and small-batch production in automation systems.

The solder wire should be stored dry and sealed to maintain flux effectiveness and the surface condition of the alloy.

The silver content enhances creep resistance, providing durability during thermal cycling in soldered joints.

This wire is compatible with manual iron soldering, wave soldering, and selective soldering methods when thermal profiles are correctly applied.

The copper addition minimizes internal voids in soldered joints, improving the overall quality of the solder connections.

The primary use of this solder wire is in electrical and automation assemblies, particularly for joining components requiring lead-free materials.

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