TE Connectivity 0.6 mm Pitch 200 Way Right Angle Board Mount DIMM Socket 2.5V 500mA 1717254-1

TE Connectivity 1717254-1 is a high-quality 0.6 mm pitch 200 way right angle board mount DIMM socket designed specifically for DDR memory modules used in computing applications. This memory socket enables secure and reliable connection of dynamic random-access memory (DRAM) modules to printed circuit boards in personal computers, servers, and workstations.

The right angle orientation and locking insertion/removal method allow efficient space utilization on PCBs and ensure modules remain firmly attached during operation. Constructed with copper alloy contacts featuring gold flash plating, this socket delivers excellent electrical performance and corrosion resistance.

Its thermoplastic housing with latching provides mechanical durability and withstands operating temperatures from -85°C to -55°C, making it suitable for demanding industrial and commercial environments. The pitch of 0.6 mm and a row spacing of 6.2 mm optimize the socket for high-density memory configurations.

This TE Connectivity DDR series memory socket carries RoHS compliance, supporting environmentally responsible manufacturing practices. The socket is designed to handle a current of 500mA at 2.5V, enabling stable power delivery to memory modules.

Applications include industrial computing, data servers, embedded systems, and any environment requiring robust and compact memory interfaces. The product is manufactured in China with rigorous quality standards to ensure reliability and compatibility.

Designed for high-density memory applications supporting DDR series modules. Right angle orientation facilitates compact PCB layouts and module mounting. Contacts made of copper alloy with gold flash plating ensure reliable conductivity.

Operating temperature range from -85°C to -55°C supports harsh environments. Thermoplastic housing provides durability and secure latching during insertion/removal. Pitch of 0.6 mm and row spacing of 6.2 mm optimize electrical and mechanical performance.

Locking mechanism secures modules firmly in place on the board. Compliant with RoHS standards, suitable for environmentally conscious designs. Manufactured in China with strict quality controls for memory socket components.

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