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Heat Flow Method For Thermal Conductivity Coefficient Measuring Instruments (Without Vaccum Device ) TCM-R-III-C
Specifications
| Model | TCM-R-III-C |
|---|---|
| Sample Thickness | 0.02-20mm |
| Thermal resistance test range | 0.05~0.000005m2 K/W |
| Thermal conductivity coefficient test range | 0.01~ 50W/m k 1 ~ 300W/m k |
| Displacement measuring range | 0~30.00mm |
| Test accuracy | better than 3% |
Key Features
- Instruments adopt 6 point temperature gradient detection, improve test accuracy
- Detectable resistance curves at different pressures, using mathematical optimization model, measurable material thermal conductivity coefficient and thermal resistance as well as contact resistance at the interface and a plurality of other parameters
Product Description
Heat Flow Method For Thermal Conductivity Coefficient Measuring Instruments (Without Vaccum Device ), TCM-R-III-C, is mainly used for testing the thermal resistance of thin thermal conductors, solid electrical insulation materials, thermal grease, resin, rubber, ceramic beryllium oxide, aluminum oxide ceramic, and other materials and contact thermal resistance of the solid material at the interface and coefficient of thermal conductivity of materials. The test material is a solid sheet, plus the frame can detect material in powder and paste material
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