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Heat Flow Method For Thermal Conductivity Coefficient Measuring Instruments (Without Vaccum Device ) TCM-R-III-C

SKU ABYXK Category Conductivity Meter Brand XiangYi Condition New

Specifications

Model TCM-R-III-C
Sample Thickness 0.02-20mm
Thermal resistance test range 0.05~0.000005m2 K/W
Thermal conductivity coefficient test range 0.01~ 50W/m k 1 ~ 300W/m k
Displacement measuring range 0~30.00mm
Test accuracy better than 3%

Key Features

  • Instruments adopt 6 point temperature gradient detection, improve test accuracy
  • Detectable resistance curves at different pressures, using mathematical optimization model, measurable material thermal conductivity coefficient and thermal resistance as well as contact resistance at the interface and a plurality of other parameters

Product Description

Heat Flow Method For Thermal Conductivity Coefficient Measuring Instruments (Without Vaccum Device ), TCM-R-III-C, is mainly used for testing the thermal resistance of thin thermal conductors, solid electrical insulation materials, thermal grease, resin, rubber, ceramic beryllium oxide, aluminum oxide ceramic, and other materials and contact thermal resistance of the solid material at the interface and coefficient of thermal conductivity of materials. The test material is a solid sheet, plus the frame can detect material in powder and paste material
Heat Flow Method For Thermal Conductivity Coefficient Measuring Instruments (Without Vaccum Device ) TCM-R-III-C
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Frequently Asked Questions

The thermal resistance test range of the TCM-R-III-C is from 0.05 to 0.000005 m² K/W.

The sample thickness range for the TCM-R-III-C is between 0.02 mm and 20 mm.

The test accuracy of this model is better than 3%.

The thermal conductivity coefficient test range for the TCM-R-III-C is from 0.01 to 50 W/m·K and from 1 to 300 W/m·K.

The displacement measuring range of the TCM-R-III-C is from 0 to 30.00 mm.

Yes, it can measure the contact thermal resistance of solid materials at the interface.

Yes, with the appropriate frame, it can detect materials in powder and paste forms.

It adopts the heat flow method for measuring the thermal conductivity coefficient.

This model utilizes a 6-point temperature gradient detection system to improve test accuracy.

The primary application is for testing thermal resistance and conductivity of various solid materials and interfaces.

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