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RND Lead-Free Solder Wire 1.01 mm Diameter, 217 °C Melting Point, Rosin Based Flux 800-7655

Category Solder Wire Brand RND Condition New

Specifications

Country of Origin United States
Brand RND
Model 800-7655
Melting Point 217°C
Product Weight 250g
Wire Diameter 1.01mm
Product Form Wire
Percent Lead 0%
Percent Silver 3%
Percent Tin 96.5%
Flux Type Rosin Based
Percent Copper 0.5%
RS PRO Wire, 1.01 mm Lead Free Solder, 217 °C Melting PointBrand RS PRO
RND SolderBrand RND
Solder Sn/Ag3/Cu 0.5 FLUX B2.1 1.0 mm 1Brand RND
Weller Wire, 1 mm Lead Free Solder, 217 °C Melting PointBrand Weller

Key Features

  • The solder wire contains 96.5% tin, 3% silver, and 0.5% copper for optimal conductivity.
  • It features a 3.3% flux content that ensures effective wetting during soldering.
  • The residue after soldering is clear and safe to leave on printed circuit boards.
  • Suitable for a wide range of soldering tasks including light brazing and prototyping.
  • Compatible with both SMD and through-hole components for repair and production applications.
  • Conforms to J-STD 006 lead-free solder alloy standard SAC305.
  • Recommended soldering tip temperature is between 360-400 °C for best results.

Product Description

RS PRO 800-7655 lead-free solder wire is a premium quality solder wire engineered for various industrial and electronics manufacturing applications. With a diameter of 1.01 mm and a melting point of 217 °C, this rosin-based flux wire ensures reliable solder joints that meet RoHS compliance standards.

The solder alloy consists of 96.5% tin, 3% silver, and 0.5% copper, classified as SAC305, recognized under JEIDA recommendations and J-STD 006 certifications for lead-free soldering. This composition provides superior electrical conductivity and mechanical strength required in modern electronics.

The solder wire flux is specially formulated to facilitate wetting on printed circuit boards and electronic components. Post soldering, the residual flux is clear and non-corrosive, eliminating the need for cleaning and improving long-term reliability.

This solder wire is multipurpose and can be used for soldering electronic assemblies, prototyping, and light brazing, making it ideal for industrial, laboratory, manufacturing, electronics repair, and R&D use cases.

Its compatibility with surface-mount devices (SMD) and through-hole components, along with a recommended soldering tip temperature range of 360-400 °C, enables precise and efficient soldering operations in commercial and industrial workshops.

The Solder Wire contains 96.5% tin, 3% silver, and 0.5% copper for optimal conductivity. It features a 3.3% flux content that ensures effective wetting during soldering. The residue after soldering is clear and safe to leave on printed circuit boards.

Suitable for a wide range of soldering tasks including light brazing and prototyping. Compatible with both SMD and through-hole components for repair and production applications. Conforms to J-STD 006 lead-free solder alloy standard SAC305.

Recommended soldering tip temperature is between 360-400 °C for best results.

RS PRO products are trusted for their reliability and quality in industrial, electronics, and manufacturing sectors. Explore the RS PRO range on EnvMart to find compatible and high-performance tools and materials for your soldering needs.

RND Lead-Free Solder Wire 1.01 mm Diameter, 217 °C Melting Point, Rosin Based Flux 800-7655
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Frequently Asked Questions

The melting point of this solder wire is 217 °C.

The diameter of this solder wire is 1.01 mm.

The solder alloy consists of 96.5% tin, 3% silver, and 0.5% copper.

This solder wire uses rosin-based flux, with a flux content of 3.3%.

The recommended soldering tip temperature for this model is between 360-400 °C.

Yes, this solder wire is compatible with both surface-mount devices (SMD) and through-hole components.

This solder wire is suitable for a wide range of soldering tasks, including electronic assemblies, prototyping, and light brazing.

The weight of this solder wire is 250 g.

Yes, it conforms to the J-STD 006 lead-free solder alloy standard SAC305.

The residue after soldering is clear and non-corrosive, making it safe to leave on printed circuit boards.

This solder wire is manufactured in the United States.

The flux content in this solder wire is 3.3%.

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