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The Dexter Corporation Polyamide Hot Melt Glue, Brown, 250 mm, Low Viscosity, Model 7804-12-250-ARP-TP10-RS
Specifications
| Country of Origin | India |
|---|---|
| Brand | The Dexter Corporation |
| Colour | Brown |
| Length | 250mm |
| Model | 7804-12-250-ARP-TP10-RS |
| Material Compatibility | Metal, Paper, Polystyrene, Wood, Card |
| Low Viscosity | Typical uses - wire staking, cable terminal encapsulation |
Key Features
- Polyamide glue with excellent gap filling performance and shock resistance.
- Low temperature flexibility ensures durability in temperature extremes.
- Easy to apply with fast fixing properties.
- UL94V-0 flame rating providing safety in electrical assemblies.
- Elastomeric with 900% elongation for flexible bonding scenarios.
- Compatible with metal, paper, polystyrene, wood, and card substrates.
- Low viscosity suited for wire staking and cable terminal encapsulation.
- Ideal for bonding printed circuit boards and electronic potting.
Product Description
The Dexter Corporation 7804-12-250-ARP-TP10-RS is a polyamide hot melt glue in brown color with a 250 mm length, suitable for advanced electronic potting and assembly tasks. It provides excellent gap filling, shock, and heat resistance, making it highly reliable in industrial electrical and mechanical applications.
This adhesive exhibits low temperature flexibility, maintaining performance even under temperature extremes, which is critical for electronics exposed to varying environments. The glue has a UL94V-0 flame rating, ensuring safety compliance in manufacturing processes.
Its elastomeric nature offers an elongation of 900%, giving the bond a tough yet flexible characteristic, ideal for substrates like metal, paper, polystyrene, wood, and card. Low viscosity makes the glue suitable for precise applications such as wire staking and cable terminal encapsulation.
The glue is applied using a polyamide glue gun and is notable for fast fixing and ease of use in various manufacturing, electronics, and assembly lines. It is also recommended for bonding printed circuit boards where durability and adhesion quality are paramount.
Polyamide glue with excellent gap filling performance and shock resistance. Low temperature flexibility ensures durability in temperature extremes. Easy to apply with fast fixing properties. UL94V-0 flame rating providing safety in electrical assemblies.
Elastomeric with 900% elongation for flexible bonding scenarios. Compatible with metal, paper, polystyrene, wood, and card substrates. Low viscosity suited for wire staking and cable terminal encapsulation. Ideal for bonding printed circuit boards and electronic potting.
This product is ideal for industrial applications including electronics manufacturing, mechanical assemblies, and general adhesive needs in various industrial sectors. Explore more high-quality adhesives and glues in EnvMart's adhesives category.
Explore more products in our Adhesives & Glues category.
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Frequently Asked Questions
The hot melt glue stick has a length of 250 mm.
It is compatible with metal, paper, polystyrene, wood, and card substrates.
This adhesive has a UL94V-0 flame rating, ensuring safety in electrical assemblies.
This low viscosity glue is typically used for wire staking and cable terminal encapsulation.
The glue is brown in color.
The adhesive has an elongation of 900%, which provides flexibility in bonding scenarios.
This product is manufactured in India.
Key features include excellent gap filling performance, shock resistance, low temperature flexibility, and fast fixing properties.
This glue is applied using a polyamide glue gun, making it easy to use in various manufacturing and assembly tasks.
It is ideal for bonding printed circuit boards and electronic potting, where durability and adhesion quality are critical.
Its low temperature flexibility ensures that it maintains performance even under varying temperature conditions.
The model number of this hot melt glue is 7804-12-250-ARP-TP10-RS.
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