Electrolube Black Potting Compound Epoxy 250 g ER2218RP250G

Electrolube ER2218RP250G Black Potting Compound Epoxy 250 g is a high-performance liquid epoxy resin designed for electrical potting applications requiring excellent insulation and mechanical protection.

This compound is hardener free from DDM or other aromatic amines, reducing hazardous exposure during processing. With a low viscosity of 800 mPa.s, it is compatible with reflow soldering processes and offers excellent flow characteristics for complete encapsulation.

It provides flame retardant properties meeting UL94 V-0, ensuring safety compliance in industrial and electronic environments.

The compound performs well under a broad temperature range from -50°C to 150°C and exhibits excellent thermal cycling and chemical resistance, making it suitable for demanding industrial, electrical, and electronic applications.

The product has excellent adhesion on various substrates and maintains flexibility to protect components from mechanical stress and vibration. Low viscosity epoxy resin suitable for reflow applications. Hardener free from DDM and aromatic amines ensuring safer handling.

Flame retardant and meets UL94 V-0 standard for safety compliance. Excellent adhesion to various substrates with good thermal cycling resistance. Operates reliably from -50°C to 150°C. Displays good flexibility, chemical and water resistance.

Cure time of 24 hours provides efficient processing. Thermal conductivity of 0.28 W/mK ensures effective heat dissipation. Specific gravity of 1.22 for consistent application thickness. Packaged in a convenient 250 g liquid pack.

This potting compound is ideal for industrial, electronics, electrical manufacturing, and repair applications requiring protection and reliable insulation of components. Explore more Potting Compounds and related industrial adhesives in the Adhesive & Pressure Sensitive Tapes category at EnvMart for your manufacturing and maintenance needs.