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Bopla BoLink Series White Polycarbonate Enclosure IP65, 15.5 mm x 70.4 mm x 42.4 mm 16174363.HMT1 BL 704015 WL2 DO - 9003

Category General Purpose Enclosures Brand Bopla Condition New

Specifications

Country of Origin India
Brand Bopla
Colour White
Body Material Polycarbonate
Model 16174363.HMT1 BL 704015 WL2 DO - 9003
IP Rating IP65
Gross Weight 30.44g
Series BoLink
External Width 42.4mm
External Height 15.5mm
Shielding Shielded
External Length 70.4mm

Key Features

  • Constructed from durable polycarbonate suitable for outdoor use.
  • BoLink series enclosure designed for modern IoT sensor technology.
  • IP65 rated to ensure protection against dust and water ingress.
  • White in color with a shielded body for enhanced protection.
  • Available in variants including options with wall brackets and lid fixing.
  • Complies with UL 746C f1-listing, ensuring fire resistance.
  • Non-flanged design with UL 94 V0 fire class rating.
  • Compact dimensions fit small sensors and electrical components.

Product Description

Bopla 16174363.HMT1 BL 704015 WL2 DO - 9003 White Polycarbonate Enclosure is an advanced sensor enclosure ideal for IoT applications, manufactured with durable polycarbonate material. The enclosure provides a robust and reliable housing solution for sensitive electronics with its IP65 ingress protection ensuring dust tight and water jet resistance. Its compact external dimensions of 15.5 mm height, 70.4 mm length, and 42.4 mm width allow it to house small electronic modules efficiently while maintaining a lightweight 30.44-gram profile.

BoLink series enclosures offer versatile mounting options with three variants: without wall brackets, with wall brackets, and with wall brackets plus lid fixing, facilitating flexible installation based on project requirements. The polycarbonate body is shielded and rated UL 94 V0 for fire safety, complemented by the UL 746C f1 listing making it suitable for outdoor environments where exposure to the elements is expected.

This model is engineered to meet modern industrial demands including automation, electrical control, and IoT sensor encapsulation in diverse sectors such as manufacturing, industrial automation, and smart building applications. The enclosure’s white color ensures aesthetic integration into most installations while preserving robust protection standards.

Made from UV-resistant polycarbonate material for enhanced outdoor durability. Provides IP65 protection against dust and water jets across all sides. Compact and lightweight form factor suited for small sensor modules. Multiple mounting options increase versatility for installation needs.

Compliant with UL fire safety standards including UL 94 V0 rating and UL 746C f1 listing. Shielded body design helps prevent electromagnetic interference. Ideal for IoT applications requiring reliable sensor protection outdoors.

Manufactured in adherence to industrial quality standards for long-term performance. Explore the full range of Bopla enclosures in the General Purpose Enclosures category at EnvMart to find the perfect fit for your technical and environmental requirements.

Bopla BoLink Series White Polycarbonate Enclosure IP65, 15.5 mm x 70.4 mm x 42.4 mm 16174363.HMT1 BL 704015 WL2 DO - 9003
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Frequently Asked Questions

The enclosure is rated IP65, providing protection against dust ingress and water jets from all directions.

The external dimensions are 15.5 mm in height, 70.4 mm in length, and 42.4 mm in width.

It is constructed from durable polycarbonate, which is suitable for outdoor use and is UV-resistant.

The gross weight of the enclosure is 30.44 grams.

This model is available in three variants: without wall brackets, with wall brackets, and with wall brackets plus lid fixing, allowing for flexible installation.

Yes, it is engineered for modern IoT applications, providing reliable housing for sensitive electronics.

Yes, it complies with UL fire safety standards, including a UL 94 V0 rating and a UL 746C f1 listing.

The enclosure is white in color, which helps it aesthetically integrate into various installations.

The shielding helps prevent electromagnetic interference, enhancing the performance of the enclosed electronics.

The enclosure is manufactured in India.

It is suitable for use in manufacturing, industrial automation, and smart building applications.

This enclosure belongs to the BoLink series, which is designed for advanced sensor technology.

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