Electrolube White Epoxy Adhesive 250 g Liquid Bag Thermally Conductive Flame Retardant ER2074

Electrolube ER2074 is a high-performance white epoxy adhesive supplied in a 250 g liquid bag format. It is a flame retardant, thermally conductive adhesive designed for potting and encapsulating electronic assemblies, particularly in applications requiring efficient heat dissipation such as LEDs.

This adhesive features very high thermal conductivity of 1.26 W/mK and emits low heat during the hardening process due to the absence of grinding fillers. Its operating temperature range spans from -40°C to 130°C, making it suitable for a broad range of industrial and commercial uses.

The setting time is approximately 5 hours with a full cure time of 24 hours at 23°C. It is resistant to water and chemicals, ensuring environmental protection and durability of encapsulated components. The product is formulated to avoid abrasion damage to dispensing equipment, offering operational advantages on production lines.

Electrolube ER2074 has a shelf life of 24 months when stored correctly. Users should note that at temperatures below 10°C, crystallization may occur, which dissolves upon warming to 50°C, enabling normal dispensing.

Applications include encapsulation of electronic assemblies for vibration isolation and stress prevention, and thermal management in LED, ceramic, rubber, plastic, and glass sectors.

Flame retardant epoxy adhesive suitable for thermal management applications. Highly thermally conductive with a conductivity of 1.26 W/mK. Setting time is 5 hours; full cure achieved in 24 hours at 23°C. Operates reliably between -40°C and 130°C.

Low heat emission during hardening with no abrasive fillers, ensuring low wear on dispensing machinery. Resistant to water and chemicals, providing good environmental protection. Shelf life of 24 months under proper storage conditions.

Ideal for encapsulating electronic assemblies and LED applications. This product is suitable for industrial, electronics manufacturing, LED production, and laboratory use where high thermal conductivity potting compounds are required.

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