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Fischer Elektronik Heatsink Universal Round Alu 28.5mm Diameter 18.5mm Height 4.25°C/W Thermal Resistance ICK S R 28,5x18,5
Specifications
| Country of Origin | Germany |
|---|---|
| Diameter | 28.5mm |
| Brand | Fischer Elektronik |
| Material | Aluminium Alloy, Thermally Conductive Glue, Thermally Conductive Foil |
| Colour | Black |
| Height | 18.5mm |
| Model | ICK S R 28,5x18,5 |
| Finish | Black Anodised |
| Thermal Resistance | 4.25°C/W |
| For Use With | Universal Round Alu |
| Fastening | Clamp, Glue, Integrated clamp, Screw |
| Compatible Package Type | PLCC, DIL/IC, PGA, BGA, LED, SMD |
Key Features
- This heatsink is designed for universal round aluminium applications.
- It features multiple fastening options including clamp, glue, integrated clamp, and screw.
- The heatsink has a black anodised finish for enhanced durability.
- Compatible with various package types such as PLCC, DIL/IC, PGA, BGA, LED, and SMD.
- Constructed from aluminium alloy combined with thermally conductive glue and foil for efficient heat dispersion.
- Manufactured in Germany ensuring high quality and reliability.
- Ideal for cooling ICs, Pentium II mobile modules, Power PC, microprocessors, Pentium III/Xeon, and related semiconductor components.
Product Description
Fischer Elektronik ICK S R 28,5x18,5 is a universal round aluminium heatsink measuring 28.5mm diameter and 18.5mm in height. It offers a thermal resistance of 4.25°C/W and is engineered to provide efficient heat dissipation for various electronic applications requiring thermal management.
This heatsink is compatible with multiple fastening methods such as clamp, glue, integrated clamps, and screws, enabling versatile mounting options suited for different assembly needs. Its black anodised finish protects the aluminium alloy body to ensure durability and sustained performance.
Designed to work seamlessly with a wide range of package types including PLCC, DIL/IC, PGA, BGA, LED, and SMD packages, this heatsink supports effective cooling of semiconductor components in industrial, electronics manufacturing, and HVAC thermal management environments.
Constructed using an aluminium alloy base paired with thermally conductive glue and foil, the product is optimized for heat transfer efficiency. Its application scope includes heat sinks for Pentium II mobile modules, ICs, Power PC processors, Pentium III/Xeon series, Dil and IC chips, PLCC and BGA packages, PGAs, LEDs, and SMD components. Manufactured in Germany, the heatsink assures stringent quality control and reliability for professional industrial use.
This Heatsink is designed for universal round aluminium use with a 28.5mm diameter. It provides 4.25°C/W thermal resistance, helping maintain semiconductor device temperature. Mounting options include clamp, glue, integrated clamp, and screw for flexible installation.
The black anodised finish ensures corrosion resistance and long-term usability. Compatible with a variety of package types such as PLCC, DIL/IC, PGA, BGA, LED, and SMD. The aluminium alloy with thermally conductive glue and foil enhances heat dissipation.
Suitable for industrial electronics, HVAC, and manufacturing cooling applications. Explore more Fischer Elektronik heat dissipation solutions at EnvMart for reliable thermal management components in electronics and industrial environments.
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Frequently Asked Questions
The heatsink has a diameter of 28.5mm and a height of 18.5mm.
It features a thermal resistance of 4.25°C/W, which helps in maintaining the temperature of semiconductor devices.
This model is constructed from an aluminium alloy, thermally conductive glue, and thermally conductive foil for efficient heat dissipation.
It is compatible with various package types including PLCC, DIL/IC, PGA, BGA, LED, and SMD.
The heatsink offers multiple fastening options including clamp, glue, integrated clamp, and screw for flexible installation.
It has a black anodised finish which enhances its durability and provides corrosion resistance.
This product is manufactured in Germany, ensuring high quality and reliability.
It is suitable for cooling applications involving ICs, Pentium II mobile modules, Power PC processors, and Pentium III/Xeon series components.
It is designed for universal round aluminium applications, providing efficient thermal management for various electronic components.
The heatsink features a black color due to its anodised finish.
Yes, it is intended for use in industrial electronics, HVAC, and manufacturing cooling applications.
Key features include its multiple fastening options, compatibility with various package types, and efficient heat dissipation capabilities.
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