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Fischer Elektronik Universal Square Aluminium Heatsink Black Anodised 28.5K/W Thermal Resistance 10 mm x 10 ICK BGA 10x10x10
Specifications
| Country of Origin | Germany |
|---|---|
| Brand | Fischer Elektronik |
| Material | Aluminium |
| Colour | Black |
| Height | 10mm |
| Length | 10mm |
| Model | ICK BGA 10x10x10 |
| Finish | Black Anodised |
| Width | 10mm |
| Thermal Resistance | 28.5K/W |
| For Use With | Universal Square Alu |
| Fastening | Conductive Foil |
| Compatible Package Type | BGA |
Key Features
- The heatsink measures 10 mm in length, 10 mm in width, and 10 mm in height.
- It is constructed from high-quality aluminium material for effective heat dissipation.
- Finished with a durable black anodised coating to enhance corrosion resistance.
- Designed for universal square applications and compatible with BGA package types.
- Mounting is facilitated using conductive foil adhesive (sold separately).
- The black anodised surface provides professional aesthetic and functional benefits.
- Manufactured in Germany ensuring high quality and reliable performance.
Product Description
Fischer Elektronik ICK BGA 10x10x10 Universal Square Aluminium Heatsink is engineered to provide reliable heat dissipation for IC processors and other electronic components. Its compact size of 10 mm by 10 mm by 10 mm makes it ideal for tight circuit board layouts where efficient thermal management is critical.
The heatsink is made from premium aluminium and features a black anodised finish that enhances its durability and thermal conductivity. Designed specifically for use with BGA package types, it offers a low thermal resistance of 28.5K/W, ensuring optimal heat transfer from the component to the ambient environment.
Installation is simplified with the use of conductive foil adhesive (not included), allowing secure and stable mounting directly onto the BGA component surface. This facilitates excellent thermal performance without the need for mechanical fastening, accommodating applications demanding compact and lightweight cooling solutions.
This heatsink is well suited for industrial electronics, laboratory instrumentation, HVAC systems, manufacturing equipment, and other scenarios where precise temperature control and component reliability are paramount. It is an ideal choice for engineers and technicians requiring dependable thermal management accessories.
Its universal square design and precise dimensions allow for versatile application across a wide range of electronic systems, supporting effective heat dissipation and improved device longevity.
The heatsink measures 10 mm x 10 mm x 10 mm for compact thermal solutions. Constructed from aluminium with a black anodised finish for durability. Thermal resistance of 28.5K/W provides effective heat dissipation. Compatible with BGA package types and universal square applications.
Requires conductive foil adhesive for mounting (not included). Explore our category for more high-quality Heatsinks and thermal management components available at EnvMart.
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Frequently Asked Questions
The heatsink measures 10 mm in length, 10 mm in width, and 10 mm in height.
It has a thermal resistance of 28.5K/W, which ensures effective heat dissipation.
This heatsink is constructed from aluminium, providing effective thermal conductivity.
Yes, it is specifically designed for compatibility with BGA package types.
Mounting is facilitated using conductive foil adhesive, which is sold separately.
It features a black anodised finish that enhances its durability and corrosion resistance.
It is manufactured in Germany, ensuring high quality and reliable performance.
It is suitable for industrial electronics, laboratory instrumentation, HVAC systems, and manufacturing equipment.
The black anodised surface provides both aesthetic and functional benefits, enhancing durability and heat dissipation.
It uses conductive foil for fastening, allowing for secure and stable mounting without mechanical fasteners.
The model number is ICK BGA 10x10x10, indicating its specific design for BGA applications.
It accommodates compact and lightweight cooling solutions, ideal for tight circuit board layouts.
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