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Fischer Elektronik Heatsink, Universal Square Aluminium, Thermal Resistance 29K/W, Dimensions 14 x 14 x 6 mm ICK BGA 14x14

Category Heatsinks Brand Fischer Elektronik Condition New

Specifications

Country of Origin Germany
Brand Fischer Elektronik
Material Aluminium
Colour Black
Height 6mm
Length 14mm
Model ICK BGA 14x14
Finish Black Anodised
Width 14mm
Thermal Resistance 29K/W
For Use With Universal Square Alu
Fastening Glue
Compatible Package Type BGA
Heatsink, BGA, 29K/W, 14 x 14 x 6mm, Adhesive Foil, Conductive FoilBrand Fischer

Key Features

  • Constructed from durable aluminium with a black anodised finish for longevity.
  • Equipped with glue fastening for secure mounting on electronic components.
  • Specifically designed for use with universal square aluminium applications and BGA packages.
  • Ideal for electronics heating and cooling components requiring efficient heat dissipation.
  • Manufactured with German engineering standards in mind, ensuring high quality and reliability.

Product Description

Fischer Elektronik ICK BGA 14x14 heatsink is a high-quality component engineered to provide efficient thermal management for electronic devices. Featuring a black anodised aluminium construction, it offers excellent durability and thermal resistance of 29K/W, making it suitable for heat dissipation in compact applications.

Measuring 14 mm in length, 14 mm in width, and 6 mm in height, this heatsink is tailored for universal square aluminium configurations and is compatible with BGA package types. The glue fastening method ensures a secure and reliable attachment to the target components.

This heatsink is ideal for use in electronics cooling and heating systems within various industrial environments including electronics manufacturing, HVAC systems, and laboratory instrumentation. Its material and finish contribute to long-term performance and resistance to environmental impacts.

The product is manufactured in Germany, reflecting stringent quality control and adherence to high engineering standards. Its black anodised surface not only aids thermal performance but also provides protection against corrosion and mechanical wear.

Durable aluminium material with black anodised finish. Dimensions: 14 mm x 14 mm x 6 mm for precise fitting. Glue fastening ensures secure mounting. Thermal resistance rating of 29K/W optimizes heat dissipation. Compatible with BGA package types and universal square aluminium applications.

Manufactured under German quality standards.

This Fischer Elektronik ICK BGA 14x14 heatsink is a reliable component choice for industries requiring efficient thermal management for integrated circuits, printed circuit boards, and other electronic assemblies. Explore a wide selection of Heatsinks and thermal management components at EnvMart for your industrial and commercial projects.

Fischer Elektronik Heatsink, Universal Square Aluminium, Thermal Resistance 29K/W, Dimensions 14 x 14 x 6 mm ICK BGA 14x14
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Frequently Asked Questions

The dimensions of this heatsink are 14 mm in length, 14 mm in width, and 6 mm in height.

The thermal resistance rating of the Fischer Elektronik ICK BGA 14x14 heatsink is 29K/W.

It is constructed from aluminium with a black anodised finish.

This model uses glue fastening for secure mounting on electronic components.

Yes, it is specifically designed to be compatible with BGA package types.

This heatsink is suitable for electronics cooling and heating systems, particularly in industrial environments such as electronics manufacturing and HVAC systems.

It is manufactured in Germany, adhering to high engineering standards.

The heatsink features a black anodised finish, which aids thermal performance and provides protection against corrosion.

The weight of this heatsink is not specified in the provided data.

The black anodised finish enhances thermal performance and protects against mechanical wear.

It is designed for use with universal square aluminium applications and BGA packages.

The design, including its dimensions and thermal resistance of 29K/W, optimizes heat dissipation for efficient thermal management.

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