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Electrolube Black Epoxy Resin Adhesive, Liquid Epoxy, 250 g, High Thermal Conductivity ER2183RP250G
Specifications
| Country of Origin | India |
|---|---|
| Brand | Electrolube |
| Colour | Black |
| Model | ER2183RP250G |
| Maximum Operating Temperature | 130°C |
| Package Type | Bag |
| Thermal Conductivity | 1.1W/mK |
| Minimum Operating Temperature | -40°C |
| Package Size | 250 g |
| Base Chemical | Epoxy |
| Standards/Approvals | RoHS, UL94 V-0 |
| Product Form | Liquid |
| Trade Name | ER2183 |
| Cure Time | 24 h |
| Mixing Ratio | 12.78:1 |
| Potting Compounds | Twin Packs |
| Setting Time | 7h |
| Mixing Ratio12.78 | 1 |
| 12.78 | 1 |
Key Features
- High thermal conductivity of 1.1 W/mK ensures efficient heat dissipation.
- Black epoxy resin with excellent oil resistance for robust industrial use.
- Setting time of 7 hours and full cure time of 24 hours for optimal processing.
- Operates reliably between -40°C and 130°C maximum temperature.
- Meets RoHS and UL94 V-0 standards, ensuring compliance with safety requirements.
- Low heat emission during curing minimizes thermal stress on electronic assemblies.
- Vibration isolation properties protect sensitive components in use.
- Suitable for encapsulating electronic assemblies in industrial, laboratory, and manufacturing environments.
Product Description
Electrolube ER2183RP250G is a black epoxy resin adhesive in liquid form, packaged in a 250 g bag, featuring high thermal conductivity of 1.1 W/mK. This epoxy resin is designed for encapsulating electronic assemblies, providing vibration isolation and stress prevention to safeguard sensitive components.
The product has a setting time of 7 hours and a cure time of 24 hours, offering efficient processing workflows. It operates effectively within a temperature range of -40°C to a maximum of 130°C, making it suitable for various demanding industrial applications.
This epoxy adhesive meets stringent standards including RoHS and UL94 V-0, ensuring compliance with environmental and fire safety requirements. Its base chemical is epoxy and it features an exact mixing ratio of 12.78:1 for optimal performance.
Electrolube ER2183RP250G exhibits low heat emission upon hardening, minimizing thermal stress during curing. At storage or transport temperatures below 10 °C, crystallisation may occur but dissolves upon heating up to 50 °C, maintaining product usability with dispensing systems.
Typical applications include potting and encapsulating electronic circuitry in industrial, laboratory, manufacturing, and fluid power tool environments. The oil-resistant and robust formulation supports extended component reliability in harsh conditions.
High thermal conductivity for effective heat dissipation. Wide operating temperature range from -40°C to 130°C. Adheres to RoHS and UL94 V-0 standards for safety. Low heat emission during curing preserves component integrity.
Precisely formulated mixing ratio ensures consistent application. Vibration isolation protects delicate assemblies. Suitable for electrical potting and encapsulation tasks. Oil-resistant, durable epoxy resin for industrial use.
Storage stability with crystallisation tolerance. Explore the range of Electrolube epoxy resins on EnvMart for superior industrial adhesive solutions.
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Frequently Asked Questions
The thermal conductivity of this epoxy resin adhesive is 1.1 W/mK, ensuring efficient heat dissipation.
This model operates reliably at a maximum temperature of 130°C.
The setting time for this adhesive is 7 hours, and it requires 24 hours for full cure.
It meets RoHS and UL94 V-0 standards, ensuring compliance with safety and environmental requirements.
The mixing ratio for this epoxy resin is 12.78:1 for optimal performance.
It is suitable for potting and encapsulating electronic circuitry in industrial, laboratory, and manufacturing environments.
The minimum operating temperature for this adhesive is -40°C.
This product is in liquid form and is packaged in a 250 g bag.
The epoxy resin adhesive is black in color.
It exhibits low heat emission during curing, which minimizes thermal stress on electronic assemblies.
The country of origin for this product is India.
It provides vibration isolation properties that protect sensitive components during use.
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