$49.51
$48.03
Tax included
World's First Climate Tech Platform | Free Delivery in India | Global Shipping

Shop with confidence knowing that our 24/7 Customer Support is always available to assist with any inquiries

Avail maximum benefits from input tax mechanism on all your Business Invoices. Get GST Invoices on your business purchases. And 0% Taxes on all worldwide deliveries

If you find this product anywhere at lower cost than us. Call us and we will not only match the price but also give a complimentary coupon

Shop with assurance, as each product we offer is 100% original, ensuring quality and authenticity with every purchase
| Country of Origin | Canada |
|---|---|
| Brand | MG Chemicals |
| Model | 832C-375ML |
| Package Size | 375 ml |
MG Chemicals 832C-375ML Epoxy Resin Adhesive is a high-quality two-part potting compound with a 375 ml package size designed to protect electronic components from environmental and mechanical damage.
This impact resistant and non-conductive epoxy resin provides excellent protection against static discharges, fungus, thermal shocks, mechanical impact, and vibrations.
Its low toxicity and water-resistant nature make it safe and effective for use in various industrial applications. The compound is non-porous and water and chemical resistant, enhancing durability and insulation properties.
Designed for use in aerospace, communications, marine, and automotive industries, this epoxy resin enhances the reliability and operational range of sensitive electronic circuits. The adhesive can be cured either at room temperature or via oven curing, with the use of silicone oil aerosol recommended as a mold release agent.
Impact resistant to safeguard electronic circuits against mechanical shock. Non-conductive formulation that prevents electrical shorts. Low toxicity ensures safer handling during application. Water and chemical resistant providing durable encapsulation.
Improves reliability and operational range of electronic components. Non-porous composition prevents moisture ingress and corrosion. Hard to remove once cured ensuring long-term protection. Suitable for aviation, communication, marine, and automotive industries.
Can be cured at room temperature or oven cured for flexible processing. Contains 375 ml of the epoxy potting compound per package.
Please refer to the official datasheet for detailed application instructions. The curing process involves an exothermic reaction; therefore, heat cure temperatures should be maintained at least 25% below the maximum temperature tolerated by the most fragile PCB components. Larger blocks require greater reductions in heat cure temperature.
This product is ideal for industrial, manufacturing, electronics assembly, and repair applications requiring durable potting compounds. Explore similar Potting Compounds in EnvMart for additional solutions.
Review sent
Your review cannot be sent
Global Payments 140+ Countries
Global Shipping Fedex/UPS/DHL/Aramex/
BlueDart/Delhivery/DP World
24/7 Customer Support Email/Chat/Telephonic Support
Comments (0)
Your review appreciation cannot be sent
Report comment
Report sent
Your report cannot be sent