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MG Chemicals Thermally Conductive 1-Part Epoxy Adhesive, Off-White Syringe, 4.9g, -65°C to 150°C, 9460TC-3ML

Category Industrial Adhesives Brand MG Chemicals Condition New

Specifications

Country of Origin Canada
Brand MG Chemicals
Colour Off-White
Model 9460TC-3ML
Viscosity Thixotropic
Maximum Operating Temperature 150°C
Specific Gravity 1.64
Package Type Syringe
Sub Type Thermal Conductive Adhesive
Thermal Conductivity 0.8 W/(m·K)
Minimum Operating Temperature -65°C
Package Size 4.9 g
ISO 9001 2015 Quality Management System
For Use With Heat Generating Components, CPUs, Gluing Heat Sinks to LEDs
Standards/Approvals ISO 9001:2015 Quality Management System
Trade Name 9460TC
Standards/ApprovalsISO 9001 2015 Quality Management System

Key Features

  • Suitable for heat-generating components, CPUs, and heat sinks.
  • Provides efficient thermal conductivity with a value of 0.8 W/(m·K).
  • Comes in an off-white, thixotropic paste for smooth application.
  • Supplied in a 4.9g syringe for precise dispensing.
  • Features an unlimited working time and easy room temperature storage.
  • Bonds effectively to a wide range of substances for durable performance.
  • Cures in 2 hours at 80°C or 30 minutes at 120°C.
  • Offers reliable electrical insulation and mechanical strength.

Product Description

MG Chemicals 9460TC-3ML thermally conductive 1-part epoxy adhesive is engineered to meet industrial thermal management applications. This off-white, thixotropic adhesive cures to form a hard, durable polymer that provides both high thermal conductivity and mechanical strength. The product is supplied in a convenient 4.9g syringe for precise dispensing, making it suitable for laboratory, manufacturing, electronics assembly, and maintenance demands.

Designed for use with heat-generating components such as CPUs and LEDs, the adhesive is ideal for attaching heat sinks or other cooling solutions to critical parts. The unlimited working time and room temperature storage allow flexibility in industrial environments, while the requirement for heat curing ensures optimal bond performance and durability.

Suitable for heat-generating components, CPUs, heat sinks, and LEDs. Efficient thermal conductivity (0.8 W/(m·K)) aids in heat dissipation. Thixotropic, off-white paste allows smooth, controlled application. Supplied in a 4.9g syringe for accuracy and minimized waste.

Unlimited working time supports complex multi-component assemblies. Cures in 2 hours at 80°C or just 30 minutes at 120°C for accelerated cycles. Strong electrical insulation supports sensitive electronic assemblies. Bonds securely to metals, ceramics, plastics, and other substrates.

Working temperature range from -65°C to 150°C delivers robust performance in demanding conditions, making this adhesive suitable for environments like industrial electronics, laboratory research, LED lighting, and commercial manufacturing. ISO 9001:2015 quality-compliant production guarantees assured reliability and consistent results in professional settings.

Industries such as HVAC, electronics, LED manufacturing, and laboratory setups can benefit from this adhesive. It facilitates efficient heat management and secure component installation for improved device longevity and safety. The off-white coloration also provides easy visual inspection post-installation.

Explore more thermally conductive adhesives and industrial supplies in the Industrial Adhesives category on EnvMart. Find trusted MG Chemicals products for professional applications.

MG Chemicals Thermally Conductive 1-Part Epoxy Adhesive, Off-White Syringe, 4.9g, -65°C to 150°C, 9460TC-3ML
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Frequently Asked Questions

The thermal conductivity of this epoxy adhesive is 0.8 W/(m·K), making it suitable for efficient heat dissipation in applications involving heat-generating components.

This adhesive operates within a temperature range of -65°C to 150°C, allowing it to perform effectively in demanding conditions.

The adhesive cures in 2 hours at 80°C or in just 30 minutes at 120°C, enabling accelerated bonding cycles for various applications.

This model has a thixotropic viscosity, which allows for smooth and controlled application during use.

The adhesive is supplied in a 4.9g syringe, which facilitates precise dispensing and minimizes waste during application.

It bonds effectively to a wide range of substances, including metals, ceramics, and plastics, making it versatile for various applications.

Yes, this adhesive is specifically designed for use with heat-generating components such as CPUs and heat sinks, ensuring efficient thermal management.

This adhesive is produced in compliance with the ISO 9001:2015 Quality Management System, ensuring reliability and consistent results.

The epoxy adhesive is off-white in color, which allows for easy visual inspection after application.

The adhesive can be stored at room temperature and has an unlimited working time, providing flexibility in industrial environments.

It is suitable for applications in industrial electronics, laboratory research, LED lighting, and commercial manufacturing, particularly where thermal management is critical.

The specific gravity of this adhesive is 1.64, which can be relevant for calculating the amount needed for specific applications.

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