KEMET 20 pF 50V dc ±5 % Multilayer Ceramic Capacitor Surface Mount 0603 C0603C200J5GACTU

KEMET C0603C200J5GACTU Multilayer Ceramic Capacitor is a 20 pF capacitance device with a rated voltage of 50V dc and a tolerance of ±5 %. It features a surface mount 0603 package designed for compact electronic assemblies.

Constructed with a stacked configuration using C0G dielectric material, this capacitor offers excellent temperature stability with capacitance variation limited to ±30 ppm/°C from -55°C to +125°C. The C0G dielectric ensures minimal change in capacitance over voltage and time, making it ideal for resonant circuits and applications requiring high Q and stable capacitance characteristics.

The device measures 1.6 mm in length, 0.8 mm in width and height, suitable for high-density PCB layouts. It is designed with a solder termination type for robust attachment to printed circuit boards.

This capacitor operates across a broad temperature range (-55°C to +125°C) and meets industry standards including EIA 481, EIA 556, EIA 624, IPC-7351, and J-STD-020, guaranteeing reliable performance and compliance with manufacturing norms. Its tape and reel packaging facilitates automated placement in industrial and commercial electronic manufacturing.

This capacitor delivers outstanding capacitance stability and minimal self-heating. It is ideal for applications such as bypass and decoupling, frequency discriminating circuits, and tuning in industrial and electronic systems.

Its Class I suppression class ensures it is suited for precise electronic circuit requirements. The product’s compact size and high operating temperature make it highly versatile for use in automotive, industrial, telecommunications, and consumer electronics.

Reliable construction and strict standards compliance ensure long-term durability and consistent performance.

KEMET capacitors like the C0603C200J5GACTU model are widely used in electronic manufacturing for circuits requiring stable, high quality capacitance in a small form factor. Suitable for electronic components assemblies in industrial, telecommunications, computing, and automotive applications.

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