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Weller Lead Free Solder Wire 0.8 mm Diameter, 217 °C Melting Point, 250g, Rosin Flux Core T0051388599
Specifications
| Country of Origin | Japan |
|---|---|
| Brand | Weller |
| Model | T0051388599 |
| Melting Point | 217°C |
| Product Weight | 250g |
| Wire Diameter | 0.8mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3% |
| Percent Tin | 96.5% |
| Flux Type | Rosin |
| Percent Copper | 0.5% |
| Weller Wire, 1 mm Lead Free Solder, 217 °C Melting PointBrand | Weller |
Key Features
- This solder wire contains 96.5% tin for strong metallurgical bonds.
- 3% silver content enhances mechanical strength of joints.
- Includes 0.5% copper to reduce copper migration in assemblies.
- Rosin flux core promotes oxide removal and clean solder flow.
- The wire form factor enables precise application in hand or machine soldering.
- Ideal for wave and hand soldering of control electronics components.
- Widely used in automation equipment and electrical connector manufacturing.
- Compatible with standard flux-removal methods used in electronics maintenance.
Product Description
Weller T0051388599 lead free solder wire features a 0.8 mm diameter and 250g spool weight, designed specifically for electronics and industrial jointing applications where lead must be avoided. This rosin-fluxed wire has a melting point of 217 °C, enabling reliable soldering at elevated temperatures.
The alloy consists of 96.5% tin providing consistent wetting and joint integrity, together with 3% silver content to improve mechanical strength and 0.5% copper to limit copper migration in assemblies. The rosin flux core aids in oxide removal and ensures smooth, clean solder flow for high-quality joints.
This solder wire is suitable for both wave and hand soldering of control electronics and is ideal for manufacturing and repairing electrical connectors. It is extensively used in automation equipment and for assembling mechanical sensors and actuators.
The 0.8 mm wire diameter allows precise application using fine-diameter feeders or standard hand feeders without any tooling modifications. The spool contains 250g of solder, providing a practical quantity for routine maintenance, small production runs, and workshop usage.
This solder wire offers excellent fatigue resistance under repeated thermal cycling due to its optimized alloy composition. The rosin flux is compatible with common electronics cleaning practices and flux-removal methods.
Manufactured in Japan, ensuring high quality and consistent performance. The solder is not certified under any standards but is widely regarded for industrial and electronics applications. Suitable for industrial, electronics manufacturing, repair, HVAC controls, automation, and laboratory use.
Explore the EnvMart catalog for Weller Solder Wires and related soldering materials to suit diverse electronic soldering needs.
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Frequently Asked Questions
The solder wire has a melting point of 217 °C, making it suitable for applications requiring reliable soldering at elevated temperatures.
This model features a wire diameter of 0.8 mm, allowing for precise application in both hand and machine soldering.
The solder wire consists of 96.5% tin, 3% silver, and 0.5% copper, which enhances joint integrity and reduces copper migration.
It utilizes a rosin flux core, which promotes oxide removal and ensures smooth, clean solder flow for high-quality joints.
The spool contains 250g of solder wire, providing a practical quantity for routine maintenance and small production runs.
This solder wire is manufactured in Japan, ensuring high quality and consistent performance.
Yes, this model is suitable for both wave and hand soldering of control electronics components.
The lead-free composition provides strong metallurgical bonds and improved mechanical strength, making it ideal for various electronics applications.
Yes, the rosin flux core is compatible with common electronics cleaning practices and flux-removal methods.
The 3% silver content enhances the mechanical strength of joints, while the 0.5% copper content helps reduce copper migration in assemblies.
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