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Fischer Elektronik Heatsink, Universal Square Aluminium, Black Anodised, 15.7K/W Thermal Resistance, 10 mm ICK BGA 35x35x10
Specifications
| Country of Origin | Germany |
|---|---|
| Brand | Fischer Elektronik |
| Material | Aluminium |
| Colour | Black |
| Height | 10mm |
| Length | 35mm |
| Model | ICK BGA 35x35x10 |
| Finish | Black Anodised |
| Width | 35mm |
| Thermal Resistance | 15.7K/W |
| For Use With | Universal Square Alu |
| Fastening | Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive |
| Compatible Package Type | BGA |
| Heatsink, BGA, 4.6K/W, 33 x 33 x 6mm, ClipBrand | Malico |
Key Features
- Constructed from high-quality aluminium for efficient heat dissipation.
- Black anodised surface provides durability and improved thermal resistance.
- Thermal resistance of 15.7K/W ensures effective cooling performance.
- Compact dimensions of 10 mm height, 35 mm length, and 35 mm width suitable for BGA components.
- Multiple fastening options including clamp, glue, integrated clamp, screw, and thermally conductive adhesive.
- Compatible with universal square aluminium BGA package types.
- Designed to be attached with thermal adhesive or conductive foil for enhanced heat transfer.
- Manufactured in Germany ensuring high product quality standards.
Product Description
Fischer Elektronik ICK BGA 35x35x10 heatsink is a premium universal square aluminium heatsink designed specifically for effective thermal management of BGA semiconductor packages.
Made from aluminium with a black anodised finish, it offers enhanced durability and superior heat dissipation capabilities. The heatsink has precise dimensions of 35 mm length, 35 mm width, and 10 mm height, matching BGA component requirements.
The thermal resistance rating of 15.7K/W ensures efficient cooling performance, preventing overheating of sensitive electronic components during operation. It can be fastened securely using diverse methods such as clamps, glue, integrated clamps, screws, or thermally conductive adhesives, providing flexible mounting options.
This heatsink is ideally suited for applications involving power PC, microprocessors, semiconductor devices, and other industrial electronics that demand reliable heat dissipation. It facilitates stable operation and longevity by maintaining optimal temperature conditions.
Manufactured in Germany, the product meets stringent quality controls, ensuring consistent performance in demanding environments. It is a new condition product, ready for immediate use in various electronics cooling systems.
Constructed from durable aluminium with black anodised finish. Compact dimensions tailored for BGA packages. Low thermal resistance of 15.7K/W for effective heat dissipation. Multiple fastening options enhance mounting flexibility.
Suitable for a wide range of semiconductor thermal management. Manufactured to German quality standards. Compatible with thermal adhesives and conductive foils (not included). Ideal for industrial, laboratory, and electronic manufacturing uses.
Facilitates cooling for microprocessors, ICs, and semiconductor devices. Reliable performance in new product condition. Explore more Fischer Elektronik Heatsinks and thermal management components in the Electronics Components category at EnvMart for your industrial and electronic assembly needs.
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Frequently Asked Questions
The thermal resistance of this heatsink is 15.7K/W, ensuring effective cooling performance for BGA components.
This heatsink has dimensions of 35 mm in length, 35 mm in width, and 10 mm in height, making it suitable for BGA packages.
It is constructed from high-quality aluminium with a black anodised finish, which enhances durability and heat dissipation.
The heatsink can be fastened using various methods including clamps, glue, integrated clamps, screws, or thermally conductive adhesives.
Yes, it is compatible with universal square aluminium BGA package types, making it versatile for different applications.
It is designed for applications involving power PCs, microprocessors, semiconductor devices, and other industrial electronics that require effective thermal management.
This product is manufactured in Germany, ensuring adherence to high quality standards.
The heatsink features a black anodised finish that provides improved durability and thermal resistance.
The weight is not specified in the provided data; please refer to the product specifications for detailed information.
It is specifically designed for BGA semiconductor packages, facilitating efficient heat dissipation during operation.
The heatsink offers multiple fastening methods including clamps, glue, integrated clamps, screws, and thermally conductive adhesives, allowing for flexible installation options.
The heatsink is black in color, which is part of its anodised finish that contributes to its thermal management capabilities.
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