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Fischer Elektronik Heatsink Universal Square Alu Black Anodised Aluminium 10.9K/W Thermal Resistance 15.24 mm ICK PGA 11x11
Specifications
| Country of Origin | Germany |
|---|---|
| Brand | Fischer Elektronik |
| Material | Aluminium |
| Colour | Black |
| Height | 15.24mm |
| Length | 27.95mm |
| Model | ICK PGA 11x11 |
| Finish | Black Anodised |
| Width | 24.76mm |
| Thermal Resistance | 10.9K/W |
| For Use With | Universal Square Alu |
| Fastening | Clamp, Conductive Adhesive, Glue, Integrated clamp, Screw |
| Compatible Package Type | PGA |
Key Features
- Manufactured from high-quality aluminium for excellent thermal conductivity.
- Black anodised surface enhances heat dissipation and corrosion resistance.
- Designed for IC processors, compatible with multiple fastening options including clamp, conductive adhesive, glue, integrated clamp, and screw.
- Suitable for cooling in applications such as Pentium processors, PLCC, PGA, microprocessors, power PCs, BGA, and SMD components.
- Produced in Germany ensuring premium quality standards.
- Compatible with universal square aluminium packages requiring efficient heat management.
- Does not include thermally conductive foil or adhesive for fixation.
Product Description
Fischer Elektronik ICK PGA 11x11 heatsink is a high-performance thermal management solution designed for electronic applications requiring efficient heat dissipation. Featuring a universal square aluminium construction with a black anodised finish, this heatsink provides excellent thermal resistance of 10.9K/W, making it ideal for IC processors and PGA package types.
The heatsink measures 27.95 mm in length, 24.76 mm in width, and 15.24 mm in height. It supports multiple mounting options including clamps, conductive adhesives, integrated clamps, glue, and screws, which allow versatile installation based on application needs. Although thermally conductive foils or adhesives are not included, they can be applied for improved thermal interface adhesion.
Manufactured in Germany, the heatsink delivers premium durability, corrosion resistance, and outstanding thermal performance, suitable for applications involving Pentium processors, PLCC ICs, microprocessors, power PCs, and BGA or SMD components. The black anodised surface not only enhances thermal radiation but also adds mechanical robustness.
This universal square alu heatsink is ideal for electronics, automation, HVAC, and other industrial sectors where efficient thermal management of compact PCBs and processors is critical.
High-quality aluminium body ensures effective heat transfer. Black anodised finish for improved heat dissipation and corrosion protection. Versatile fastening methods: clamp, glue, screws, and integrated clamp. Optimized dimensions for universal PGA package compatibility.
Reliable performance in cooling Pentium and other IC processors. Made in Germany, confirming strict manufacturing standards. Does not include fixing thermal foils or adhesives.
Explore more Heatsinks and thermal management components in the Electronics Components category at EnvMart to find the right solutions for your industrial and electronic thermal challenges.
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Frequently Asked Questions
The Fischer Elektronik ICK PGA 11x11 heatsink has a thermal resistance of 10.9K/W, making it suitable for efficient heat dissipation in electronic applications.
This heatsink measures 27.95 mm in length, 24.76 mm in width, and 15.24 mm in height, optimized for universal PGA package compatibility.
The heatsink is manufactured from high-quality aluminium, which ensures effective heat transfer and durability.
It supports multiple fastening options including clamps, conductive adhesives, glue, integrated clamps, and screws, allowing for versatile installation based on application needs.
This model is compatible with universal square aluminium packages, specifically designed for PGA types.
It is manufactured in Germany, ensuring compliance with premium quality standards.
The heatsink features a black anodised finish, which enhances heat dissipation and provides corrosion resistance.
It is suitable for cooling applications involving Pentium processors, PLCC ICs, microprocessors, power PCs, and BGA or SMD components.
No, the heatsink does not include thermally conductive foils or adhesives for fixation; these can be applied separately for improved thermal interface adhesion.
The heatsink is finished in black, which not only enhances its aesthetic appeal but also contributes to its thermal performance.
The model number is ICK PGA 11x11, indicating its specific design for PGA package types.
The black anodised surface enhances heat dissipation and provides additional protection against corrosion.
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