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Fischer Elektronik Heatsink PCB Mounting 11K/W Thermal Resistance 25 mm Height 37.5 mm Length 29 mm Width SK452-37,5SA

Category Heatsink Brand Fischer Elektronik Condition New

Specifications

Country of Origin Germany
Brand Fischer Elektronik
Colour Black
Height 25mm
Length 37.5mm
Model SK452-37,5SA
Width 29mm
Thermal Resistance 11K/W
For Use With PCB mounting

Key Features

  • The heatsink measures 25 mm in height, 37.5 mm in length, and 29 mm in width.
  • Constructed with a black finish suitable for efficient thermal management.
  • Designed to dissipate heat effectively for solid state relays and similar electronics.
  • Manufactured in Germany ensuring high quality and reliability.
  • Flatback design optimized for vertical fin placement in free air for best cooling performance.
  • Compatible specifically with printed circuit board mounting applications.
  • No standards or approvals applicable to this component.

Product Description

Fischer Elektronik SK452-37,5SA heatsink is a precision-engineered component designed for efficient thermal management in electronic assemblies requiring PCB mounting. It features a thermal resistance of 11K/W, enabling effective heat dissipation for solid state relays and related electronic devices.

The heatsink dimensions are 25 mm in height, 37.5 mm length along the fins, and 29 mm width. The black-colored flatback design ensures optimal mounting and thermal conduction, with fins arranged vertically for maximum cooling in free air conditions.

Manufactured in Germany, this heatsink meets stringent quality standards for electronic thermal management solutions. It does not carry specific certifications or approvals.

This component is widely used in industrial, laboratory, and commercial electronic applications where reliable heat dissipation is crucial to prolong the lifecycle and improve performance of electronic modules.

The heatsink measures 25 mm in height, 37.5 mm long along the fins, and 29 mm wide with a black finish. Thermal resistance of 11K/W facilitates efficient heat transfer from sensitive components. Flatback profile suited for PCB mounting optimizes integration into electronic assemblies.

Designed for solid state relay cooling and similar thermal management purposes. Manufactured in Germany ensuring premium build quality and durability. Fins oriented vertically to maximize natural convection cooling in free air.

No compliance with specific industry standards or approvals required for this product.

This Fischer Elektronik heatsink is a reliable solution for engineers and technicians seeking quality thermal management components. It fits well into categories such as electronics components and Heatsinks, useful in electronics manufacturing, repair, and design.

Explore more quality components and accessories in the Electronics & Electricals section of EnvMart for your industrial and laboratory thermal management needs.

Fischer Elektronik Heatsink PCB Mounting 11K/W Thermal Resistance 25 mm Height 37.5 mm Length 29 mm Width SK452-37,5SA
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Frequently Asked Questions

The heatsink measures 25 mm in height, 37.5 mm in length, and 29 mm in width.

It has a thermal resistance of 11K/W, facilitating effective heat dissipation.

This model is designed for PCB mounting applications, particularly for cooling solid state relays and similar electronic devices.

The heatsink features a black finish, which is suitable for efficient thermal management.

It is manufactured in Germany, ensuring a high standard of quality.

The flatback design with vertically oriented fins maximizes natural convection cooling in free air conditions.

The specific materials are not detailed, but it is constructed to facilitate thermal management efficiently.

This component does not carry specific certifications or approvals.

It is suitable for industrial, laboratory, and commercial electronic applications requiring reliable heat dissipation.

The model number is SK452-37,5SA.

The black finish is designed to enhance thermal management efficiency.

The flatback profile and vertical fin arrangement optimize integration and thermal conduction, improving cooling performance.

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