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Bergquist Thermally Conductive Double-Sided Heatsink Adhesive Tape 150 x 140 x 0.127 mm BP100-0.005-00-00-12
Specifications
| Country of Origin | United States |
|---|---|
| Brand | Bergquist |
| Model | BP100-0.005-00-00-12 |
| Accessory Type | Adhesive Tape |
| For Use With | Heatsink |
| Standards/Approvals | RoHS |
| Bergquist Heatsink Adhesive Tape for use with HeatsinkBrand | Bergquist |
Key Features
- The tape provides high bond strength with long term exposure to moderate heat and high humidity.
- It replaces traditional heat cure adhesives, screw mounting, and clip mounting methods.
- Commonly used for mounting heatsinks to BGA graphic processors, computer processors, and drive processors.
- The product complies with RoHS standards ensuring environmental safety.
- It is designed to attain high bond strength with long term exposure to moderate heat and high humidity.
- Can be used instead of Heat Cure Adhesives, Screw Mounting, Clip Mounting.
- Home/Electrical, Automation & Cables/HVAC, Fans & Thermal Management/Electronics Heating & Cooling Components/Heatsink Mounting Accessories
- View all in Heatsink Mounting AccessoriesSearch for similar products
Product Description
Bergquist BP100-0.005-00-00-12 is a thermally conductive, double-sided adhesive tape designed specifically for mounting heatsinks in electronics cooling applications. The tape offers reliable bonding performance even under moderate heat conditions and high humidity environment, making it ideal for durable and long-lasting heatsink attachment.
This adhesive tape serves as a superior alternative to heat cure adhesives, screw mounting, and clip mounting methods. It enhances thermal management efficiency by securely bonding heatsinks to components such as BGA graphic processors, computer processors, and drive processors.
The tape measures 150 mm in length, 140 mm in width, and has a thickness of 0.127 mm, providing an optimal balance of mechanical strength and thermal conductivity to meet demanding industrial and commercial electronics cooling needs.
Bergquist's product adheres to RoHS standards, ensuring compliance with international environmental regulations. Originating from the United States, this tape is a trusted choice for industrial, electronics manufacturing, HVAC thermal management, and laboratory thermal solutions.
The tape provides high bond strength with long term exposure to moderate heat and high humidity. It replaces traditional heat cure adhesives, screw mounting, and clip mounting methods. Dimensions are 150 x 140 x 0.127 mm, suitable for various heatsink applications.
Commonly used for mounting Heatsinks to BGA graphic processors, computer processors, and drive processors. The product complies with RoHS standards ensuring environmental safety. Explore the Electronics Components category at EnvMart for more thermal management solutions and accessories from Bergquist and other leading brands.
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Frequently Asked Questions
The tape measures 150 mm in length, 140 mm in width, and has a thickness of 0.127 mm.
This model is designed for mounting heatsinks to components such as BGA graphic processors, computer processors, and drive processors.
It complies with RoHS standards, ensuring environmental safety and adherence to international regulations.
The adhesive tape originates from the United States.
It is a thermally conductive, double-sided adhesive tape designed for effective thermal management in electronics cooling applications.
It serves as a superior alternative to heat cure adhesives, screw mounting, and clip mounting methods, providing reliable bonding performance.
It is designed to provide high bond strength under moderate heat and high humidity conditions.
Yes, it is a trusted choice for industrial electronics manufacturing, HVAC thermal management, and laboratory thermal solutions.
The model number is BP100-0.005-00-00-12.
This product is categorized as an adhesive tape specifically designed for heatsink applications.
It provides high bond strength suitable for long-term exposure to moderate heat and high humidity.
It enhances thermal management efficiency by securely bonding heatsinks to critical electronic components, improving overall performance.
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