Bergquist Thermally Conductive Double-Sided Heatsink Adhesive Tape BP100-0.005-00-1112

Bergquist BP100-0.005-00-1112 is a thermally conductive, double-sided pressure sensitive adhesive tape designed specifically for heatsink mounting applications requiring strong and durable bonds. This tape is engineered to maintain high bond strength even during long-term exposure to moderate heat and high humidity conditions, making it ideal for demanding industrial environments.

It offers a practical alternative to traditional heat cure adhesives, screw mounting, and clip mounting, simplifying installation while ensuring effective thermal management. The tape is available in four different sizes, catering to a variety of heatsink dimensions and applications.

Typical use cases include mounting heatsinks to ball grid array (BGA) graphic processors, computer processors, and drive processors, where efficient heat dissipation and secure attachment are critical for optimal device performance.

The product complies with RoHS directives, ensuring it is safe for use in electronics manufacturing with reduced levels of hazardous substances. Manufactured in the United States, this tape embodies quality and reliability for industrial, electronics, and thermal management systems.

Key features include its thermal conductivity, double-sided adhesive nature, and resistance to environmental conditions, making it highly suitable for electronics cooling solutions.

The tape ensures high bond strength under prolonged exposure to moderate heat and high humidity. Can replace heat cure adhesives, screw mounting, and clip mounting methods. Available in multiple sizes to fit different heatsinks.

Designed for mounting heatsinks on BGA graphic processors and other processors. RoHS compliant for environmental safety. Manufactured in the United States ensuring trusted quality. Explore more products in the Adhesive Tape category at EnvMart for comprehensive thermal management solutions from trusted brands like Bergquist.